Datasheet ADXL180 (Analog Devices) - 8

ADXL180 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
Parameter Rating
rating only; functional operation of the device at these or any Supply Voltage (VBP − VBN) −0.3 V to +21 V other conditions above those indicated in the operational Voltage at Any Pin with −0.3 V to VDD + 0.3 V Respect to V section of this specification is not implied. Exposure to absolute BN Except VBP Storage Temperature Range −55°C to +150°C maximum rating conditions for extended periods may affect Soldering Temperature 255°C device reliability. Operating Temperature Range −40°C to +125°C
ESD CAUTION
ESD All Pins 1.5 kV HBM Latch-Up Current 100 mA Mechanical Shock Unpowered ±4000 g (0.5 ms, half sine) Powered ±2000 g (0.5 ms, half sine); −0.3 V to +7.0 V Drop Test (onto Concrete)1 1.2 m Thermal Gradient ±20°C/minute 1 Soldered to FR4 coupon printed circuit board (PCB) at the dimensions of 25.4 mm × 25 mm. During test, the PCB is fastened to a support with 46 g mass, equivalent to a typical satellite module PCB.
tP tP CRITICAL ZONE RAMP-UP tL TO tP t E L t R L T U SMAX T A PER EM T T SMIN RAMP-DOWN tS PREHEAT
02
T
0
A = 25°C
4-
t = 25°C TO PEAK
54 07
TIME
Figure 2. ADXL180 Pb-Free Solder Profile
Table 3. ADXL Solder Profile Parameters Profile Feature Small Body Pb-Free Assemblies
Average Ramp-Up Rate (TL to TP) 3°C/second maximum Preheat Temperature Min (TS min) to Temperature Max (TS max) 150°C to 200°C Time (min to max) (tS) 60 sec to 180 sec TS max to TL Ramp-Up Rate 3°C/second maximum Time Maintained Above Temperature (TL) 217°C Time (tL) 60 sec to 150 sec Peak Temperature (TP) 260°C +5/−5°C Time Within 5°C of Actual Peak Temperature (tP) 20 sec to 40 sec Ramp-Down Rate 6°C/sec maximum Time 25°C to Peak Temperature 8 minutes maximum Rev. A | Page 7 of 60 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY THEORY OF OPERATION OVERVIEW ACCELERATION SENSOR SIGNAL PROCESSING DIGITAL COMMUNICATIONS STATE MACHINE 2-WIRE CURRENT MODULATED INTERFACE SYNCHRONOUS OPERATION AND DUAL DEVICE BUS PROGRAMMED MEMORY AND CONFIGURABILITY Factory-Programmed Serial Number and Manufacturer Information User-Programmable Data Register User-Programmed Configuration Physical Layer (ISO Layer 1) Data Link Layer (ISO Layer 2) Application Layer (ISO Layer 7) PHYSICAL INTERFACE APPLICATION CIRCUIT CURRENT MODULATION MANCHESTER DATA ENCODING OPERATION AT LOW VBP OR LOW VDD OPERATION AT HIGH VDD COMMUNICATIONS TIMING AND BUS TOPOLOGIES DATA TRANSMISSION ASYNCHRONOUS COMMUNICATION Asynchronous Single Device Point-to-Point Topology SYNCHRONOUS COMMUNICATION Configuring the ADXL180 for Synchronous Operation Synchronization Pulse Detection Bus Discharge Enable Synchronous Single Device Point-to-Point Topology SYNCHRONOUS COMMUNICATION MODE—DUAL DEVICE Configuring Synchronous Operation Delay Selection Fixed Delay Mode Autodelay Mode Dual Device Synchronous Parallel Topology Dual Device Synchronous Series Topology DATA FRAME DEFINITION DATA FRAME TRANSMISSION FORMAT DATA FRAME CONFIGURATION OPTIONS ACCELERATION DATA CODING STATE VECTOR CODING STATE VECTOR DESCRIPTIONS TRANSMISSION ERROR DETECTION OPTIONS CRC Encoding Parity Encoding APPLICATION LAYER: COMMUNICATION PROTOCOL STATE MACHINE ADXL180 STATE MACHINE PHASE 1: POWER-ON-RESET INITIALIZATION PHASE 2: DEVICE DATA TRANSMISSION Overview Influence of MD on Data Range Device Data Mapping in Phase 2 PHASE 2: MODE DESCRIPTION Mode 0 Asynchronous Mode Synchronous Mode Mode 1 Mode 2 Device Data User Bits and User Register (UREG) 10-Bit Data and Mode 2 Mode 3 Device Data User Register (UREG) Use with State Vector Enabled Illegal Configuration: Mode 3 and 8-Bit Data PHASE 3: SELF-TEST DIAGNOSTIC Concept of Self-Test Internal and External Self-Test Option External Self-Test Internal Self-Test Influence of MD Selections On Transmitted Self-Test Data PHASE 4: AUTO-ZERO INITIALIZATION Fast Auto-Zero Mode Error Reporting PHASE 5: NORMAL OPERATION Slow Auto-Zero Error Reporting SIGNAL RANGE AND FILTERING TRANSFER FUNCTION OVERVIEW RANGE THREE-POLE BESSEL FILTER AUTO-ZERO OPERATION Offset Drift Monitoring ERROR DETECTION OVERVIEW PARITY ERROR DUE TO COMMUNICATIONS PROTOCOL CONFIGURATION BIT ERROR SELF-TEST ERROR OFFSET ERROR/OFFSET DRIFT MONITORING VOLTAGE REGULATOR MONITOR RESET OPERATION TEST AND DIAGNOSTIC TOOLS VSCI SIGNAL CHAIN INPUT TEST PIN VSCO ANALOG SIGNAL CHAIN OUTPUT TEST PIN CONFIGURATION SPECIFICATION OVERVIEW CONFIGURATION MODE TRANSMIT COMMUNICATIONS PROTOCOL CONFIGURATION MODE COMMAND (RECEIVE) COMMUNICATIONS PROTOCOL CONFIGURATION MODE COMMUNICATIONS HANDSHAKING CONFIGURATION AND USER DATA REGISTERS CONFIGURATION MODE EXIT SERIAL NUMBER AND MANUFACTURER IDENTIFICATION DATA REGISTERS PROGRAMMING THE CONFIGURATION AND USER DATA REGISTERS OTP PROGRAMMING CONDITIONS AND CONSIDERATIONS CONFIGURATION/USER REGISTER OTP PARITY CONFIGURATION MODE ERROR REPORTING CONFIGURATION REGISTER REFERENCE UD[7:0] USER DATA BITS UD8 CONFIGURATION BIT BDE SCOE FDLY ADME STI FC[1:0] RG[2:0] MD[1:0] SYEN AZE ERC DAT SVD CUPAR AND CUPRG AXIS OF SENSITIVITY BRANDING OUTLINE DIMENSIONS ORDERING GUIDE