Datasheet ADXRS810 (Analog Devices) - 4

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Data Sheet ADXRS810 SPECIFICATIONS
Specification conditions at TA = 25°C, PDD = 5 V, angular rate = 0°/sec, bandwidth = f0/200, ±1 g, continuous self-test on.
Table 1. Parameter Test Conditions/Comments Symbol Min Typ Max Unit
MEASUREMENT RANGE Full-scale range FSR ±300 °/sec SENSITIVITY See Figure 2 Nominal Sensitivity 80 LSB/°/sec Sensitivity Tolerance At 25°C ±1 % Sensitivity Temperature Drift From −40°C to +25°C or 25°C to 85°C −3 +3 % Nonlinearity1 Best fit straight line 0.05 % FSR rms Cross-Axis Sensitivity2 ±3 % NULL Null Accuracy At 25°C ±2 °/sec Null Temperature Drift −40°C to +25°C or 25°C to 85°C −4 +4 °/sec Overall Null Accuracy1 −40°C to +85°C −8 +8 °/sec Null Drift Gradient −40°C to +85°C −0.1 +0.1 °/s/°C NOISE PERFORMANCE Rate Noise Density T = 25°C 0.015 °/sec/√Hz A T = −40°C to 105°C 0.020 °/sec/√Hz A LOW-PASS FILTER Cut-Off (−3 dB) Frequency f /200, see Figure 10 f 77.5 Hz 0 LP Group Delay3 Frequency = 0 Hz t 3.25 4 4.75 ms LP SENSOR RESONANT FREQUENCY f 13 15.5 19 kHz 0 SHOCK AND VIBRATION IMMUNITY Sensitivity-to-Linear Acceleration DC to 5 kHz 0.03 °/sec/g SELF-TEST See the Continuous Self-Test section Magnitude 2559 LSBs Fault Register Threshold Compared to LOCST data 2239 2879 LSBs Sensor Data Status Threshold Compared to LOCST data 1279 3839 LSBs Frequency f /32 f 485 Hz 0 ST ST Low-Pass Filter −3 dB Frequency f /8000 1.95 Hz 0 ST Low-Pass Filter Group Delay3 64 ms SPI COMMUNICATIONS Clock Frequency f 8.08 MHz OP Voltage Input High MOSI, CS, SCLK V 0.85 × P P + 0.3 V IH DD DD Voltage Input Low MOSI, CS, SCLK V −0.3 P × 0.15 V IL DD Output Voltage Low MISO, current = 3 mA V 0.5 V OL Output Voltage High MISO, current = −2 mA V P − 0.5 V OH DD Input/Output Leakage Current MISO, MOSI, SCLK, V = 0 V I −0.1 0 µA OL IL MISO, MOSI, SCLK, V = P I 0 0.1 µA OL DD IH Internal Pull-Up Current CS, P = 3.3 V, I 60 200 µA DD CS = 0.15 × PDD PU CS, P = 5 V, 80 300 µA DD CS = 0.15 × PDD TEMPERATURE SENSOR Value at 45°C 0 LSB Scale Factor 5 LSB/°C Rev. 0 | Page 3 of 28 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Thermal Resistance Rate Sensitive Axis ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Continuous Self-Test Applications Information Calibrated Performance Mechanical Considerations for Mounting Application Circuit ADXRS810 Signal Chain Timing SPI Communications Characteristics SPI Communication Protocol—Applications Device Data Latching Command/Response SPI Communication Protocol—Bit Definitions Command/Response Bit Descriptions ADXRS810 Fault Register Bit Definitions CHK Bit Assertion: Recommended Start-Up Routine SPI Rate Data Format ADXRS810 Memory Map Memory Register Definitions 0x00 RATE1, 0x01 RATE0 0x02 TEM1, 0x03 TEM0 0x04 LOCST1, 0x05 LOCST0 0x06 HICST1, 0x07 HICST0 0x08 QUAD1, 0x09 QUAD0 0x0A FAULT1, 0x0B FAULT0 0x0C PID1, 0x0D PID0 0x0E SN3, 0x0F SN2, 0x10 SN1, 0x11 SN0 Suggested PCB Layout Solder Profile Package Marking Codes Outline Dimensions Ordering Guide Automotive Products