Datasheet CD4070BMS, CD4077BMS (Intersil) - 8
| 制造商 | Intersil |
| 描述 | CMOS Quad Exclusive OR and Exclusive NOR Gates |
| 页数 / 页 | 8 / 8 — Typical Performance Characteristics. (Continued). 105 6 AMBIENT … |
| 修订版 | 2017-12-22 |
| 文件格式/大小 | PDF / 271 Kb |
| 文件语言 | 英语 |
Typical Performance Characteristics. (Continued). 105 6 AMBIENT TEMPERATURE (T. AMBIENT TEMPERATURE (T. A) = +25oC
该数据表的模型线
文件文字版本
CD4070BMS, CD4077BMS
Typical Performance Characteristics (Continued) 105 6 AMBIENT TEMPERATURE (T AMBIENT TEMPERATURE (T A) = +25oC A) = +25oC 4 LOAD CAPACITANCE (CL) = 50pF (
W) 2 D) 104 P 6 SUPPLY VOLTAGE , tPLH) (ns) 300 E ( 4 (VDD) = 15V HL T 2 A 103 G 6 4 IME (tP PER 2 200 Y T 102 ON 6 10V TI 4 2 10V A P 10 5V ION DELA 6 100 SSI T 4 R DI 2 LOAD CAPACITANCE AGA 1 6 CL = 50pF OP 4 R POWE 2 CL = 15pF P 10-1 0 5 10 15 20 2 4 6 8 2 4 6 8 2 4 6 8 2 4 6 8 2 4 6 8 SUPPLY VOLTAGE (VDD) (V) 10-1 1 10 102 103 104 INPUT FREQUENCY (fI) (kHz) FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF SUPPLY VOLTAGE FUNCTION OF INPUT FREQUENCY Chip Dimensions and Pad Layout CD4077BMSH
Dimensions and pad layout for CD4070BMSH are identical Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch).
METALLIZATION:
Thickness: 11kÅ 14kÅ, AL.
PASSIVATION:
10.4kÅ - 15.6kÅ, Silane
BOND PADS:
0.004 inches X 0.004 inches MIN
DIE THICKNESS:
0.0198 inches - 0.0218 inches FN3322 Rev 0.00 Page 8 of 8 December 1992
Typical Performance Characteristics (Continued) 105 6 AMBIENT TEMPERATURE (T AMBIENT TEMPERATURE (T A) = +25oC A) = +25oC 4 LOAD CAPACITANCE (CL) = 50pF (
W) 2 D) 104 P 6 SUPPLY VOLTAGE , tPLH) (ns) 300 E ( 4 (VDD) = 15V HL T 2 A 103 G 6 4 IME (tP PER 2 200 Y T 102 ON 6 10V TI 4 2 10V A P 10 5V ION DELA 6 100 SSI T 4 R DI 2 LOAD CAPACITANCE AGA 1 6 CL = 50pF OP 4 R POWE 2 CL = 15pF P 10-1 0 5 10 15 20 2 4 6 8 2 4 6 8 2 4 6 8 2 4 6 8 2 4 6 8 SUPPLY VOLTAGE (VDD) (V) 10-1 1 10 102 103 104 INPUT FREQUENCY (fI) (kHz) FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF SUPPLY VOLTAGE FUNCTION OF INPUT FREQUENCY Chip Dimensions and Pad Layout CD4077BMSH
Dimensions and pad layout for CD4070BMSH are identical Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch).
METALLIZATION:
Thickness: 11kÅ 14kÅ, AL.
PASSIVATION:
10.4kÅ - 15.6kÅ, Silane
BOND PADS:
0.004 inches X 0.004 inches MIN
DIE THICKNESS:
0.0198 inches - 0.0218 inches FN3322 Rev 0.00 Page 8 of 8 December 1992