Datasheet OP262 (Analog Devices) - 3

1.3 Absolute maximum ratings. 1/ Supply voltage ... ±6 V Input voltage .. ±6 V 2/ Differential input voltage .. ±0.6 V 3/ Internal power dissipation SOIC (S) .. Observe derating curves Output short circuit duration .. Observe derating curves Operating temperature range: ... -55°C to +125°C Storage temperature range ... -65°C to +150°C Junction temperature range .. -65°C to +150°C Lead temperature range (Soldering, 10 sec) .. 300°C 1.4 Thermal characteristics. Thermal resistance Case outline θJA 4/ θJC Unit Case X 157 56 °C/W 2. APPLICABLE DOCUMENTS JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 – Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC – Solid State Technology Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. Manufacturer’s name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2/ For supply voltage greater than 6 V, the input voltage is limited to less than or equal to the supply voltage. 3/ For differential input voltages greater than 0.6 V, the input current should be limited to less than 5 mA to prevent degradation or destruction of the input device. 4/ θJA is specified for the worst case conditions, that is, θJA is specified for a device soldered in circuit board for SOIC package.
DLA LAND AND MARITIME
SIZE CODE IDENT NO. DWG NO.
COLUMBUS, OHIO A 16236 V62/12639
REV PAGE 3 Document Outline DESCRIPTION REV REV PMIC N/A TITLE SIZE A V62/12639 REV