Datasheet OP284CHIPS (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | Precision Rail-to-Rail Input and Output Operational Amplifier |
| 页数 / 页 | 5 / 5 — Data Sheet. OP284CHIPS. OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS |
| 文件格式/大小 | PDF / 245 Kb |
| 文件语言 | 英语 |
Data Sheet. OP284CHIPS. OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS
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Data Sheet OP284CHIPS OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS
Die center is the reference location at 0.0 μm × 0.0 μm. Pad coordinates are to the center of each pad. Waffle pack orientation is the chamfer corner to the OUTA pad.
Table 4. Pad Mnemonics, Function Descriptions, and Coordinates Mnemonic Description Pad Coordinates (μm)
OUTA Output of Channel A. −660 × +780 −INA Negative Input Channel A. −608 × +149 +INA Positive Input Channel A. −608 × −107 V− Pad Negative Power Supply. Substrate is connected to V−. −662 × −780 +INB Positive Input Channel B. +590 × −800 −INB Negative Input Channel B. +586 × −424 OUTB Output Channel B. 570 × 437 V+ Positive Power Supply. 590 × 802 NC No Connect—Factory Use Only. −664 × −490 NC No Connect—Factory Use Only. 524 × 0
ORDERING GUIDE Model Functional Temperature Range Package Option/Count Package Option
OP284CHIPS −40°C to +125°C Waffle Pack/221 DIE
©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12642-0-12/14(A)
Rev. A | Page 5 of 5 Document Outline FEATURES GENERAL DESCRIPTION OP284 CHIP DIMENSIONS AND PAD LAYOUT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS, VSY = ±15.0 V ABSOLUTE MAXIMUM RATINGS ESD CAUTION OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS ORDERING GUIDE
Die center is the reference location at 0.0 μm × 0.0 μm. Pad coordinates are to the center of each pad. Waffle pack orientation is the chamfer corner to the OUTA pad.
Table 4. Pad Mnemonics, Function Descriptions, and Coordinates Mnemonic Description Pad Coordinates (μm)
OUTA Output of Channel A. −660 × +780 −INA Negative Input Channel A. −608 × +149 +INA Positive Input Channel A. −608 × −107 V− Pad Negative Power Supply. Substrate is connected to V−. −662 × −780 +INB Positive Input Channel B. +590 × −800 −INB Negative Input Channel B. +586 × −424 OUTB Output Channel B. 570 × 437 V+ Positive Power Supply. 590 × 802 NC No Connect—Factory Use Only. −664 × −490 NC No Connect—Factory Use Only. 524 × 0
ORDERING GUIDE Model Functional Temperature Range Package Option/Count Package Option
OP284CHIPS −40°C to +125°C Waffle Pack/221 DIE
©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12642-0-12/14(A)
Rev. A | Page 5 of 5 Document Outline FEATURES GENERAL DESCRIPTION OP284 CHIP DIMENSIONS AND PAD LAYOUT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS, VSY = ±15.0 V ABSOLUTE MAXIMUM RATINGS ESD CAUTION OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS ORDERING GUIDE