AD822-EPABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCETable 4. θ Parameter Rating JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Supply Voltage ±18 V Internal Power Dissipation Table 5. Thermal Resistance 8-Lead SOIC_N (R) Observe Maximum Package TypeθJAθJC Unit Junction Temperature 8-lead SOIC_N (R) 160 43 °C/W Input Voltage ((V+) + 0.2 V) to ((V−) − 20 V) Output Short-Circuit Duration Indefinite ESD CAUTION Differential Input Voltage ±30 V Storage Temperature Range (R) –65°C to +150°C Operating Temperature Range −55°C to +125°C Maximum Junction Temperature 150°C Lead Temperature 260°C (Soldering, 60 sec) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 10 of 20 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE