Datasheet BFR92A (NXP) - 10
| 制造商 | NXP |
| 描述 | NPN 5 GHz wideband transistor |
| 页数 / 页 | 12 / 10 — PACKAGE OUTLINE. Plastic surface mounted package; 3 leads. SOT23. … |
| 修订版 | 4.0 |
| 文件格式/大小 | PDF / 284 Kb |
| 文件语言 | 英语 |
PACKAGE OUTLINE. Plastic surface mounted package; 3 leads. SOT23. DIMENSIONS (mm are the original dimensions). UNIT. max
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NXP Semiconductors Product specification NPN 5 GHz wideband transistor BFR92A
PACKAGE OUTLINE Plastic surface mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A b e v max. p c D E e1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT23 97-02-28 Rev. 04 - 2 March 2009 10 of 12 Document Outline FEATURES DESCRIPTION APPLICATIONS PINNING QUICK REFERENCE DATA LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS PACKAGE OUTLINE Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Revision history
PACKAGE OUTLINE Plastic surface mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A b e v max. p c D E e1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT23 97-02-28 Rev. 04 - 2 March 2009 10 of 12 Document Outline FEATURES DESCRIPTION APPLICATIONS PINNING QUICK REFERENCE DATA LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS PACKAGE OUTLINE Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Revision history