Datasheet IRF3205PbF (Infineon) - 2
| 制造商 | Infineon |
| 描述 | HEXFET Power MOSFET |
| 页数 / 页 | 8 / 2 — Electrical Characteristics @ TJ = 25°C (unless otherwise specified). … |
| 文件格式/大小 | PDF / 221 Kb |
| 文件语言 | 英语 |
Electrical Characteristics @ TJ = 25°C (unless otherwise specified). Parameter. Min. Typ. Max. Units. Conditions
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IRF3205PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 55 ––– ––– V VGS = 0V, ID = 250µA ∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.057 ––– V/°C Reference to 25°C, ID = 1mA RDS(on) Static Drain-to-Source On-Resistance ––– ––– 8.0 mΩ VGS = 10V, ID = 62A VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250µA gfs Forward Transconductance 44 ––– ––– S VDS = 25V, ID = 62A ––– ––– 25 V IDSS Drain-to-Source Leakage Current µA DS = 55V, VGS = 0V ––– ––– 250 VDS = 44V, VGS = 0V, TJ = 150°C Gate-to-Source Forward Leakage ––– ––– 100 VGS = 20V IGSS nA Gate-to-Source Reverse Leakage ––– ––– -100 VGS = -20V Qg Total Gate Charge ––– ––– 146 ID = 62A Qgs Gate-to-Source Charge ––– ––– 35 nC VDS = 44V Qgd Gate-to-Drain ("Miller") Charge ––– ––– 54 VGS = 10V, See Fig. 6 and 13 td(on) Turn-On Delay Time ––– 14 ––– VDD = 28V tr Rise Time ––– 101 ––– ID = 62A ns td(off) Turn-Off Delay Time ––– 50 ––– RG = 4.5Ω tf Fall Time ––– 65 ––– VGS = 10V, See Fig. 10 Between lead, D LD Internal Drain Inductance ––– 4.5 ––– 6mm (0.25in.) nH from package G LS Internal Source Inductance ––– 7.5 ––– and center of die contact S Ciss Input Capacitance ––– 3247 ––– VGS = 0V Coss Output Capacitance ––– 781 ––– VDS = 25V Crss Reverse Transfer Capacitance ––– 211 ––– pF ƒ = 1.0MHz, See Fig. 5 EAS Single Pulse Avalanche Energy ––– 1050 264 mJ IAS = 62A, L = 138µH
Source-Drain Ratings and Characteristics Parameter Min. Typ. Max. Units Conditions
D IS Continuous Source Current MOSFET symbol ––– ––– 110 (Body Diode) showing the A G ISM Pulsed Source Current integral reverse 390 (Body Diode) S ––– ––– p-n junction diode. VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 62A, VGS = 0V trr Reverse Recovery Time ––– 69 104 ns TJ = 25°C, IF = 62A Qrr Reverse Recovery Charge ––– 143 215 nC di/dt = 100A/µs ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by Pulse width ≤ 400µs; duty cycle ≤ 2%. max. junction temperature. ( See fig. 11 ) Calculated continuous current based on maximum allowable Starting TJ = 25°C, L = 138µH junction temperature. Package limitation current is 75A. RG = 25Ω, IAS = 62A. (See Figure 12) This is a typical value at device destruction and represents ISD ≤ 62A, di/dt ≤ 207A/µs, VDD ≤ V(BR)DSS, operation outside rated limits. TJ ≤ 175°C This is a calculated value limited to TJ = 175°C. 2 www.irf.com
Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 55 ––– ––– V VGS = 0V, ID = 250µA ∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.057 ––– V/°C Reference to 25°C, ID = 1mA RDS(on) Static Drain-to-Source On-Resistance ––– ––– 8.0 mΩ VGS = 10V, ID = 62A VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250µA gfs Forward Transconductance 44 ––– ––– S VDS = 25V, ID = 62A ––– ––– 25 V IDSS Drain-to-Source Leakage Current µA DS = 55V, VGS = 0V ––– ––– 250 VDS = 44V, VGS = 0V, TJ = 150°C Gate-to-Source Forward Leakage ––– ––– 100 VGS = 20V IGSS nA Gate-to-Source Reverse Leakage ––– ––– -100 VGS = -20V Qg Total Gate Charge ––– ––– 146 ID = 62A Qgs Gate-to-Source Charge ––– ––– 35 nC VDS = 44V Qgd Gate-to-Drain ("Miller") Charge ––– ––– 54 VGS = 10V, See Fig. 6 and 13 td(on) Turn-On Delay Time ––– 14 ––– VDD = 28V tr Rise Time ––– 101 ––– ID = 62A ns td(off) Turn-Off Delay Time ––– 50 ––– RG = 4.5Ω tf Fall Time ––– 65 ––– VGS = 10V, See Fig. 10 Between lead, D LD Internal Drain Inductance ––– 4.5 ––– 6mm (0.25in.) nH from package G LS Internal Source Inductance ––– 7.5 ––– and center of die contact S Ciss Input Capacitance ––– 3247 ––– VGS = 0V Coss Output Capacitance ––– 781 ––– VDS = 25V Crss Reverse Transfer Capacitance ––– 211 ––– pF ƒ = 1.0MHz, See Fig. 5 EAS Single Pulse Avalanche Energy ––– 1050 264 mJ IAS = 62A, L = 138µH
Source-Drain Ratings and Characteristics Parameter Min. Typ. Max. Units Conditions
D IS Continuous Source Current MOSFET symbol ––– ––– 110 (Body Diode) showing the A G ISM Pulsed Source Current integral reverse 390 (Body Diode) S ––– ––– p-n junction diode. VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 62A, VGS = 0V trr Reverse Recovery Time ––– 69 104 ns TJ = 25°C, IF = 62A Qrr Reverse Recovery Charge ––– 143 215 nC di/dt = 100A/µs ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by Pulse width ≤ 400µs; duty cycle ≤ 2%. max. junction temperature. ( See fig. 11 ) Calculated continuous current based on maximum allowable Starting TJ = 25°C, L = 138µH junction temperature. Package limitation current is 75A. RG = 25Ω, IAS = 62A. (See Figure 12) This is a typical value at device destruction and represents ISD ≤ 62A, di/dt ≤ 207A/µs, VDD ≤ V(BR)DSS, operation outside rated limits. TJ ≤ 175°C This is a calculated value limited to TJ = 175°C. 2 www.irf.com