Datasheet AP1910 (Anwell Semiconductor) - 9
| 制造商 | Anwell Semiconductor |
| 描述 | Universal High Brightness LED Driver Controller |
| 页数 / 页 | 11 / 9 — AP1910 Anwell Semiconductor Corp. Classification Reflow Profiles. Profile … |
| 文件格式/大小 | PDF / 583 Kb |
| 文件语言 | 英语 |
AP1910 Anwell Semiconductor Corp. Classification Reflow Profiles. Profile Feature. Pb-Free / Green Assembly
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AP1910 Anwell Semiconductor Corp. Classification Reflow Profiles Profile Feature Pb-Free / Green Assembly
Average ramp-up rate 3°C/second max (TL to TP) Preheat 150°C - Temperature Min (Tsmin) 200°C - Temperature Max (Tsmax) - Time (min to max) (ts) 60-180 seconds Time maintained above: 217°C - Temperature (TL) - Time (t 60-150 seconds L) Peak/Classification Temperature (Tp) See table 1 Time within 5°C of actual 20-40 seconds Peak Temperature (tp) Ramp-down Rate 6°C/second max Time 25°C to Peak Temperature 8 minutes max Notes： 1) All temperatures refer to topside of the package. 2) Measured on the body surface.
Classification Reflow Profiles (Continued)
Table 1. Pb-free / Green Process – Package Classification Reflow Temperatures
Volume mm³ Volume mm³ Volume mm³ Package Thickness <350 350~2000
≧
2000
<2.5 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6-2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≧2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* Notes： * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. All reserved by AnSC © 2012 Page: 9/11 V1.6-2014/09/29
Average ramp-up rate 3°C/second max (TL to TP) Preheat 150°C - Temperature Min (Tsmin) 200°C - Temperature Max (Tsmax) - Time (min to max) (ts) 60-180 seconds Time maintained above: 217°C - Temperature (TL) - Time (t 60-150 seconds L) Peak/Classification Temperature (Tp) See table 1 Time within 5°C of actual 20-40 seconds Peak Temperature (tp) Ramp-down Rate 6°C/second max Time 25°C to Peak Temperature 8 minutes max Notes： 1) All temperatures refer to topside of the package. 2) Measured on the body surface.
Classification Reflow Profiles (Continued)
Table 1. Pb-free / Green Process – Package Classification Reflow Temperatures
Volume mm³ Volume mm³ Volume mm³ Package Thickness <350 350~2000
≧
2000
<2.5 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6-2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≧2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* Notes： * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. All reserved by AnSC © 2012 Page: 9/11 V1.6-2014/09/29