Datasheet ADuM4470, ADuM4471, ADuM4472, ADuM4473, ADuM4474 (Analog Devices) - 9

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Data Sheet ADuM4470/ADuM4471/ADuM4472/ADuM4473/ADuM4474 Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Logic High Output Voltages VOAH, VOBH, VDDA − 0.3, 3.3 V IOx = −20 µA, VIx = VIxH VOCH, VODH VISO − 0.3 VDDA − 0.5, 3.1 V IOx = −4 mA, VIx = VIxH VISO − 0.5 Logic Low Output Voltages VOAL, VOBL, 0.0 0.1 V IOx = 20 µA, VIx = VIxH VOCL, VODL 0.0 0.4 V IOx = 4 mA, VIx = VIxH AC SPECIFICATIONS ADuM447xARIZ Minimum Pulse Width PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay tPLH, tPHL 55 100 ns CL = 15 pF, CMOS signal levels Pulse Width Distortion, |tPLH − tPHL| PWD 40 ns CL = 15 pF, CMOS signal levels Propagation Delay Skew tPSK 50 ns CL = 15 pF, CMOS signal levels Channel-to-Channel Matching tPSKCD/tPSKOD 50 ns CL = 15 pF, CMOS signal levels ADuM447xCRIZ Minimum Pulse Width PW 40 ns CL = 15 pF, CMOS signal levels Maximum Data Rate 25 Mbps CL = 15 pF, CMOS signal levels Propagation Delay tPLH, tPHL 30 50 70 ns CL = 15 pF, CMOS signal levels Pulse Width Distortion, |tPLH − tPHL| PWD 8 ns CL = 15 pF, CMOS signal levels Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew tPSK 15 ns CL = 15 pF, CMOS signal levels Channel-to-Channel Matching, tPSKCD 8 ns CL = 15 pF, CMOS signal levels Codirectional Channels Channel-to-Channel Matching, tPSKCD 15 ns CL = 15 pF, CMOS signal levels Opposing Directional Channels Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels Common-Mode Transient Immunity |CMH| 25 35 kV/µs VIx = VDDA or VISO, VCM = 1000 V, at Logic High Output transient magnitude = 800 V Common-Mode Transient Immunity |CML| 25 35 kV/µs VIx = 0 V or VISO, VCM = 1000 V, at Logic Low Output transient magnitude = 800 V Refresh Rate fr 1.0 Mbps 1 VDD1 is the power supply for the push-pull transformer. 2 VDDA is the power supply of Side 1 of the ADuM447x. 3 The contributions of supply current values for all four channels are combined at identical data rates. 4 The VISO supply current is available for external use when all data rates are below 2 Mbps. At data rates above 2 Mbps, the data I/O channels draw additional current proportional to the data rate. Additional supply current associated with an individual channel operating at a given data rate can be calculated as described in the Power Consumption section. The dynamic I/O channel load must be treated as an external load and included in the VISO power budget. 5 The power demands of the quiescent operation of the data channels were not separated from the power supply section. Efficiency includes the quiescent power consumed by the I/O channels as part of the internal power consumption. 6 This current is available for driving external loads at the VISO output. All channels are simultaneously driven at a maximum data rate of 25 Mbps with full capacitive load representing the maximum dynamic load conditions. Refer to the Power Consumption section for calculation of available current at less than the maximum data rate. Rev. 0 | Page 9 of 36 Document Outline Features Applications Functional Block Diagram General Description Revision History Block Diagrams of I/O Channels Specifications Electrical Characteristics—5 V Primary Input Supply/5 V Secondary Isolated Supply Electrical Characteristics—3.3 V Primary Input Supply/3.3 V Secondary Isolated Supply Electrical Characteristics—5 V Primary Input Supply/3.3 V Secondary Isolated Supply Electrical Characteristics—5 V Primary Input Supply/15 V Secondary Isolated Supply Package Characteristics Regulatory Approvals (Pending) Insulation and Safety-Related Specifications DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Characteristics Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Applications Information Theory of Operation Application Schematics Transformer Design Transformer Turns Ratio Transformer ET Constant Transformer Primary Inductance and Resistance Transformer Isolation Voltage Switching Frequency Transient Response Component Selection Printed Circuit Board (PCB) Layout Thermal Analysis Propagation Delay-Related Parameters DC Correctness and Magnetic Field Immunity Power Consumption Power Considerations Soft Start Mode and Current-Limit Protection Data Channel Power Cycle Insulation Lifetime Outline Dimensions Ordering Guide