Datasheet ADuM5200, ADuM5201, ADuM5202 (Analog Devices) - 6

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ADuM5200/ADuM5201/ADuM5202 Data Sheet Table 9. Input and Output Characteristics Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS Logic High Input Threshold V 0.7 V or 0.7 V V IH ISO DD1 Logic Low Input Threshold V 0.3 V or 0.3 V V IL ISO DD1 Logic High Output Voltages V V − 0.3 or V − 0.3 3.3 V I = −20 µA, V = V OH DD1 ISO Ox Ix IxH V − 0.5 or V − 0.5 3.1 V I = −4 mA, V = V DD1 ISO Ox Ix IxH Logic Low Output Voltages V 0.0 0.1 V I = 20 µA, V = V OL Ox Ix IxL 0.0 0.4 V I = 4 mA, V = V Ox Ix IxL Undervoltage Lockout V , V , V supplies DD1 DDL ISO Positive Going Threshold V 2.7 V UV+ Negative Going Threshold V 2.4 V UV− Hysteresis V 0.3 V UVH Input Currents per Channel I −20 +0.01 +20 µA 0 V ≤ V ≤ V I Ix DDx AC SPECIFICATIONS Output Rise/Fall Time t /t 2.5 ns 10% to 90% R F Common-Mode Transient |CM| 25 35 kV/µs V = V or V , V = 1000 V, Ix DD1 ISO CM Immunity1 transient magnitude = 800 V Refresh Rate f 1.0 Mbps r 1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.7 × VDD1 or 0.7 × VISO for a high output or VO < 0.3 × VDD1 or 0.3 × VISO for a low output. The common-mode voltage slew rates apply to both rising and fal ing common-mode voltage edges. Rev. B | Page 6 of 28 Document Outline Features Applications General Description Functional Block Diagrams Table of Contents Revision History Specifications Electrical Characteristics—5 V Primary Input Supply/5 V Secondary Isolated Supply Electrical Characteristics—3.3 V Primary Input Supply/3.3 V Secondary Isolated Supply Electrical Characteristics—5 V Primary Input Supply/3.3 V Secondary Isolated Supply Package Characteristics Regulatory Information Insulation and Safety-Related Specifications IEC 60747-5-2 (VDE 0884, Part 2):2003-01 Insulation Characteristics Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Truth Table Typical Performance Characteristics Terminology Applications Information PCB Layout Start-Up Behavior EMI Considerations Propagation Delay Parameters DC Correctness and Magnetic Field Immunity Power Consumption Current Limit and Thermal Overload Protection Power Considerations Thermal Analysis Increasing Available Power Insulation Lifetime Outline Dimensions Ordering Guide