Datasheet LT1027 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | Precision 5 Volt Reference |
| 页数 / 页 | 8 / 7 — EQUIVALE T SCHE ATIC. PACKAGE DESCRIPTIO. H Package. 8-Lead TO-5 Metal … |
| 文件格式/大小 | PDF / 220 Kb |
| 文件语言 | 英语 |
EQUIVALE T SCHE ATIC. PACKAGE DESCRIPTIO. H Package. 8-Lead TO-5 Metal Can (.230 Inch PCD). OBSOLETE PACKAGE
该数据表的模型线
文件文字版本
LT1027
U W EQUIVALE T SCHE ATIC
VIN VOUT NR VADJ 1027 ES GND OUTPUT CURRENT LIMIT AND BIAS CIRCUITS NOT SHOWN
U PACKAGE DESCRIPTIO H Package 8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321) 0.335 – 0.370 (8.509 – 9.398) DIA 0.305 – 0.335 (7.747 – 8.509) 0.040 (1.016) 0.050 MAX (1.270) 0.165 – 0.185 MAX (4.191 – 4.699) REFERENCE SEATING PLANE PLANE GAUGE PLANE 0.500 – 0.750 (12.700 – 19.050) 0.010 – 0.045* (0.254 – 1.143) 0.016 – 0.021** (0.406 – 0.533) 0.027 – 0.045 (0.686 – 1.143) 45°TYP PIN 1 0.028 – 0.034 (0.711 – 0.864) 0.230 (5.842) TYP 0.110 – 0.160 (2.794 – 4.064) *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE INSULATING AND 0.045" BELOW THE REFERENCE PLANE STANDOFF 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H8 (TO-5) 0.230 PCD 1197
OBSOLETE PACKAGE
sn1027 1027fcs Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7
U W EQUIVALE T SCHE ATIC
VIN VOUT NR VADJ 1027 ES GND OUTPUT CURRENT LIMIT AND BIAS CIRCUITS NOT SHOWN
U PACKAGE DESCRIPTIO H Package 8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321) 0.335 – 0.370 (8.509 – 9.398) DIA 0.305 – 0.335 (7.747 – 8.509) 0.040 (1.016) 0.050 MAX (1.270) 0.165 – 0.185 MAX (4.191 – 4.699) REFERENCE SEATING PLANE PLANE GAUGE PLANE 0.500 – 0.750 (12.700 – 19.050) 0.010 – 0.045* (0.254 – 1.143) 0.016 – 0.021** (0.406 – 0.533) 0.027 – 0.045 (0.686 – 1.143) 45°TYP PIN 1 0.028 – 0.034 (0.711 – 0.864) 0.230 (5.842) TYP 0.110 – 0.160 (2.794 – 4.064) *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE INSULATING AND 0.045" BELOW THE REFERENCE PLANE STANDOFF 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H8 (TO-5) 0.230 PCD 1197
OBSOLETE PACKAGE
sn1027 1027fcs Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7