REF43DICE CHARACTERISTICS2.VIN3.TEMPERATURE OUT4A. GROUND* 4B. GROUND* 5.TRIM6A. VOUT FO2. VIN 6B. VOUT SENSE‡*PADS 4A AND 4B MUST BOTH BE BONDED TO GROUND. ‡VOUT FORCE AND SENSE ARE TYPICALLY BONDED TOGETHER AT THE LOAD.DIE SIZE 0.085 ⴛ 0.062 inch, 5270 sq. mils(2.16 ⴛ 1.57 mm, 3.39 sq. mm) –4– REV. D Document Outline FEATURES GENERAL DESCRIPTION PIN CONFIGURATION ORDERING GUIDE SIMPLIFIED SCHEMATIC ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS BURN-IN CIRCUIT OUTPUT VOLTAGE TRIM METHOD DICE CHARACTERISTICS WAFER TEST LIMITS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION GENERATING A –2.5V REFERENCE BOOST TRANSISTOR PROVIDES HIGH OUTPUT CURRENT LOW POWER CMOS DAC REFERENCE PRECISION CURRENT SOURCE TEMPERATURE MEASUREMENT OUTLINE DIMENSIONS Revision History