Datasheet LTM4653 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | EN55022B Compliant 58V, 4A Step-Down DC/DC µModule Regulator |
| 页数 / 页 | 32 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1) (All Voltages … |
| 修订版 | A |
| 文件格式/大小 | PDF / 1.5 Mb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1) (All Voltages Relative to V –. OUT Unless Otherwise Indicated)
文件文字版本
LTM4653
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (All Voltages Relative to V – OUT Unless Otherwise Indicated)
Terminal Voltages TOP VIEW 1 2 3 4 5 6 7 VIN, VD, SVIN, SW, VOUT, VOSNS, ISETa ..–0.3V to 60V VIN GND, ISETb, EXTV A CC .. –0.3V to 28V RUN .. GND–0.3V to PGND+60V CLKIN NC VD B INTVCC, PGDFB, VINREG, COMPa, COMPb, IMONb IMONa SV PGND IN IMONa, IMONb .. –0.3V to 4V C fSET ...–0.3V to INTVCC PGOOD PGDFB VINREG GND D CLKIN, PGOOD (Relative to GND) ... –0.3V to 6V COMPb COMPa fSET SGND NC Terminal Currents E INTVCC Peak Output Current (Note 8) ..30mA ISETb ISETa EXTVCC RUN TEMP+ ..–1mA to 10mA F INTV TEMP– ...–10mA to 1mA CC G Temperatures VOSNS SGND SW H Internal Operating Temperature Range TEMP+ TEMP– TEMP+ TEMP– (Note 2) ... –40°C to 125°C J Storage Temperature Range .. –55°C to 125°C PGND K Peak Solder Reflow Package VOUT NC Body Temperature .. 245°C L BGA PACKAGE 77-PIN (15mm × 9mm × 5.01mm) TJMAX = 125°C θJCtop = 20.6°C/W, θJCbottom = 5.1°C/W, θJB = 6.0°C/W, θJA = 15.5°C/W θ VALUES DETERMINED PER JESD51-12 WEIGHT = 1.8 GRAMS
ORDER INFORMATION http://www.linear.com/product/LTM4653#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4653EY#PBF SAC305 (RoHS) e1 –40°C to 125°C LTM4653IY#PBF SAC305 (RoHS) LTM4653Y e1 BGA 3 –40°C to 125°C LTM4653IY SnPb (63/37) e0 –40°C to 125°C • Device temperature grade is indicated by a label on the shipping container. • Recommended BGA PCB Assembly and Manufacturing Procedures: • Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/BGA-assy • Terminal Finish Part Marking: www.linear.com/leadfree • BGA Package and Tray Drawings: www.linear.com/packaging • This product is not recommended for second side reflow. For more • This product is moisture sensitive. For more information, go to: information, go to www.linear.com/BGA-assy www.linear.com/BGA-assy Rev 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Test Circuit Decoupling Requirements Operation Operation Operation Applications Information Typical Applications Package Photograph Package Description Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (All Voltages Relative to V – OUT Unless Otherwise Indicated)
Terminal Voltages TOP VIEW 1 2 3 4 5 6 7 VIN, VD, SVIN, SW, VOUT, VOSNS, ISETa ..–0.3V to 60V VIN GND, ISETb, EXTV A CC .. –0.3V to 28V RUN .. GND–0.3V to PGND+60V CLKIN NC VD B INTVCC, PGDFB, VINREG, COMPa, COMPb, IMONb IMONa SV PGND IN IMONa, IMONb .. –0.3V to 4V C fSET ...–0.3V to INTVCC PGOOD PGDFB VINREG GND D CLKIN, PGOOD (Relative to GND) ... –0.3V to 6V COMPb COMPa fSET SGND NC Terminal Currents E INTVCC Peak Output Current (Note 8) ..30mA ISETb ISETa EXTVCC RUN TEMP+ ..–1mA to 10mA F INTV TEMP– ...–10mA to 1mA CC G Temperatures VOSNS SGND SW H Internal Operating Temperature Range TEMP+ TEMP– TEMP+ TEMP– (Note 2) ... –40°C to 125°C J Storage Temperature Range .. –55°C to 125°C PGND K Peak Solder Reflow Package VOUT NC Body Temperature .. 245°C L BGA PACKAGE 77-PIN (15mm × 9mm × 5.01mm) TJMAX = 125°C θJCtop = 20.6°C/W, θJCbottom = 5.1°C/W, θJB = 6.0°C/W, θJA = 15.5°C/W θ VALUES DETERMINED PER JESD51-12 WEIGHT = 1.8 GRAMS
ORDER INFORMATION http://www.linear.com/product/LTM4653#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4653EY#PBF SAC305 (RoHS) e1 –40°C to 125°C LTM4653IY#PBF SAC305 (RoHS) LTM4653Y e1 BGA 3 –40°C to 125°C LTM4653IY SnPb (63/37) e0 –40°C to 125°C • Device temperature grade is indicated by a label on the shipping container. • Recommended BGA PCB Assembly and Manufacturing Procedures: • Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/BGA-assy • Terminal Finish Part Marking: www.linear.com/leadfree • BGA Package and Tray Drawings: www.linear.com/packaging • This product is not recommended for second side reflow. For more • This product is moisture sensitive. For more information, go to: information, go to www.linear.com/BGA-assy www.linear.com/BGA-assy Rev 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Test Circuit Decoupling Requirements Operation Operation Operation Applications Information Typical Applications Package Photograph Package Description Typical Application Related Parts