Datasheet LTM8073 (Analog Devices) - 2

LTM8073
absoluTe MaxiMuM raTings pin conFiguraTion (Notes 1, 2)
V TOP VIEW IN, RUN Voltage ..65V PG Voltage ..42V RUN BANK 2 GND VIN AUX, VOUT, BIAS Voltage ..19V 6 FB, TR/SS Voltage...4V RT TR/SS SYNC Voltage ..6V 5 SHARESYNC BANK 1 BANK 3 Maximum Internal Temperature (Note 4) .. 125°C 4 PG GND VOUT Storage Temperature.. –55°C to 125°C 3 AUX Peak Solder Reflow (Package Body) Temperature ..250°C BIAS 2 GND FB 1 A B C D E F G H 48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE TJMAX = 125°C, θJA = 23.6°C/W, θJCbottom = 4.4°C/W, θJCtop = 11.3°C/W, θJB = 2.8°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC 51-9, 51-12
orDer inForMaTion http://www.linear.com/product/LTM8073#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING (Note 3)
LTM8073EY#PBF SAC305 (RoHS) LTM8073 e1 BGA 3 –40°C to 125°C LTM8073IY#PBF • Consult Marketing for parts specified with wider operating temperature • Recommended BGA PCB Assembly and Manufacturing Procedures: ranges. *Device temperature grade is indicated by a label on the shipping www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree 8073fa 2 For more information www.linear.com/LTM8073 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Package PHOTOS Package Description Revision History Typical Application Related Parts