Datasheet LTM4650-1 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | Dual 25A or Single 50A µModule Regulator with 0.8% DC and 3% Transient Accuracy |
| 页数 / 页 | 36 / 2 — absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion … |
| 文件格式/大小 | PDF / 673 Kb |
| 文件语言 | 英语 |
absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion http://www.linear.com/product/LTM4650-1#orderinfo
该数据表的模型线
文件文字版本
LTM4650-1
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V TOP VIEW IN ..–0.3V to 16V TEMP EXTV V CC SW1, VSW2 ..–1V to 16V M PGOOD1, PGOOD2, RUN1, RUN2, L INTVCC, EXTVCC .. –0.3V to 6V VIN K MODE_PLLIN, fSET, TRACK1, TRACK2, J DIFFOUT, PHASMD ... –0.3V to INTVCC H INTV V CLKOUT CC OUT1, VOUT2, VOUTS1, VOUTS2 (Note 6) .. –0.3V to 6V SW1 SW2 PGOOD1 DIFFP, DIFFN ... –0.3V to INTV G CC PHASMD RUN1 SGND PGOOD2 RUN2 INTV F MODE_PLLIN CC Peak Output Current ..100mA GND COMP1 COMP2 DIFFOUT DIFFP Internal Operating Temperature Range E DIFFN TRACK1 SGND VFB2 TRACK2 V GND FB1 (Note 2) ... –40°C to 125°C D f V SET SGND OUTS2 Storage Temperature Range .. –55°C to 125°C C VOUTS1 Peak Package Body Temperature .. 245°C B VOUT1 V GND OUT2 A 1 2 3 4 5 6 7 8 9 10 11 12 BGA PACKAGE 144-LEAD (16mm × 16mm × 5.01mm) TJMAX = 125°C, θJA = 7°C/W, θJCbottom = 1.5°C/W, θJCtop = 3.7°C/W, θJB + θJBA ≅ 7°C/W θ VALUES DEFINED PER JESD 51-12 WEIGHT = 3.5g
orDer inForMaTion http://www.linear.com/product/LTM4650-1#orderinfo PART MARKING* PACKAGE MSL TOTAL DC TEMPERATURE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING ACCURACY RANGE (Note 2)
LTM4650EY-1A#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±0.8% –40°C to 125°C LTM4650IY-1A#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±0.8% –40°C to 125°C LTM4650EY-1B#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±1.5% –40°C to 125°C LTM4650IY-1B#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±1.5% –40°C to 125°C LTM4650IY-1A SnPb (63/37) LTM4650Y-1 e0 BGA 3 ±0.8% –40°C to 125°C LTM4650IY-1B SnPb (63/37) LTM4650Y-1 e0 BGA 3 ±1.5% –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended BGA PCB Assembly and Manufacturing Procedures: ranges. *Device temperature grade is indicated by a label on the shipping www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: • Terminal Finish Part Marking: www.linear.com/packaging www.linear.com/leadfree 46501fc 2 For more information www.linear.com/LTM4650-1 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photo Design Resources Related Parts
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V TOP VIEW IN ..–0.3V to 16V TEMP EXTV V CC SW1, VSW2 ..–1V to 16V M PGOOD1, PGOOD2, RUN1, RUN2, L INTVCC, EXTVCC .. –0.3V to 6V VIN K MODE_PLLIN, fSET, TRACK1, TRACK2, J DIFFOUT, PHASMD ... –0.3V to INTVCC H INTV V CLKOUT CC OUT1, VOUT2, VOUTS1, VOUTS2 (Note 6) .. –0.3V to 6V SW1 SW2 PGOOD1 DIFFP, DIFFN ... –0.3V to INTV G CC PHASMD RUN1 SGND PGOOD2 RUN2 INTV F MODE_PLLIN CC Peak Output Current ..100mA GND COMP1 COMP2 DIFFOUT DIFFP Internal Operating Temperature Range E DIFFN TRACK1 SGND VFB2 TRACK2 V GND FB1 (Note 2) ... –40°C to 125°C D f V SET SGND OUTS2 Storage Temperature Range .. –55°C to 125°C C VOUTS1 Peak Package Body Temperature .. 245°C B VOUT1 V GND OUT2 A 1 2 3 4 5 6 7 8 9 10 11 12 BGA PACKAGE 144-LEAD (16mm × 16mm × 5.01mm) TJMAX = 125°C, θJA = 7°C/W, θJCbottom = 1.5°C/W, θJCtop = 3.7°C/W, θJB + θJBA ≅ 7°C/W θ VALUES DEFINED PER JESD 51-12 WEIGHT = 3.5g
orDer inForMaTion http://www.linear.com/product/LTM4650-1#orderinfo PART MARKING* PACKAGE MSL TOTAL DC TEMPERATURE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING ACCURACY RANGE (Note 2)
LTM4650EY-1A#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±0.8% –40°C to 125°C LTM4650IY-1A#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±0.8% –40°C to 125°C LTM4650EY-1B#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±1.5% –40°C to 125°C LTM4650IY-1B#PBF SAC305 (RoHS) LTM4650Y-1 e1 BGA 3 ±1.5% –40°C to 125°C LTM4650IY-1A SnPb (63/37) LTM4650Y-1 e0 BGA 3 ±0.8% –40°C to 125°C LTM4650IY-1B SnPb (63/37) LTM4650Y-1 e0 BGA 3 ±1.5% –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended BGA PCB Assembly and Manufacturing Procedures: ranges. *Device temperature grade is indicated by a label on the shipping www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: • Terminal Finish Part Marking: www.linear.com/packaging www.linear.com/leadfree 46501fc 2 For more information www.linear.com/LTM4650-1 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photo Design Resources Related Parts