Datasheet LTM4675 (Analog Devices) - 3

LTM4675
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1) Terminal Voltages:
TOP VIEW V 1 2 3 4 5 6 7 8 9 INn (Note 4), SVIN ... –0.3V to 20V A VOUTn ... –0.3V to 6V B V + + OSNS0 , VORB0 , VOSNS1, VORB1, INTVCC .. –0.3V to 6V VOUT0 VIN0 RUN C n, SDA, SCL, ALERT ... –0.3V to 5.5V F D SWPHCFG, VOUTnCFG, VTRIMnCFG, ASEL .. –0.3V to 2.75V V E DD33, GPIOn, SYNC, SHARE_CLK, WP, COMP – – F na, VOSNS0 , VORB0 .. –0.3V to 3.6V GND SGND SGND .. –0.3V to 0.3V G H
Temperatures
J Internal Operating Temperature Range K (Notes 2, 3) .. –40°C to 125°C VOUT1 VIN1 L Storage Temperature Range .. –55°C to 125°C M Peak Solder Reflow Package Body Temperature ... 245°C BGA PACKAGE 108-LEAD (16mm × 11.9mm × 3.51mm) TJMAX = 125°C, θJCtop = 5.9°C/W, θJCbottom = 2.1°C/W, θJB = 2.7°C/W, θJA = 16°C/W θ VALUES DETERMINED PER JESD51-12 WEIGHT = 1.7 GRAMS
orDer inForMaTion http://www.linear.com/product/LTM4675#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (See Note 2) DEVICE FINISH CODE
LTM4675EY#PBF SAC305 (RoHS) LTM4675Y e1 BGA 4 –40°C to 125°C LTM4675IY#PBF SAC305 (RoHS) LTM4675Y e1 BGA 4 –40°C to 125°C LTM4675IY SnPb (63/37) LTM4675Y e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4675fb For more information www.linear.com/LTM4675 3 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Functional Diagram Test Circuits Operation Power Module Introduction Power Module Configurability and Readback Data Time-Averaged and Peak Readback Data Power Module Overview EEPROM Serial Interface Device Addressing Fault Detection and Handling Responses to VOUT and IOUT Faults Responses to Timing Faults Responses to SVIN OV Faults Responses to OT/UT Faults Responses to External Faults Fault Logging Bus Timeout Protection PMBus Command Summary PMBus Commands VIN to VOUT Step-Down Ratios Input Capacitors Output Capacitors Light Load Current Operation Switching Frequency and Phase Minimum On-Time Considerations Variable Delay Time, Soft-Start and Output Voltage Ramping Digital Servo Mode Soft Off (Sequenced Off) Undervoltage Lockout Fault Detection and Handling Open-Drain Pins Phase-Locked Loop and Frequency Synchronization RCONFIG Pin-Straps (External Resistor Configuration Pins) Voltage Selection Connecting the USB to the I2C/SMBus/PMBus Controller to the LTM4675 In System LTpowerPlay: An Interactive GUI for Digital Power System Management PMBus Communication and Command Processing Thermal Considerations and Output Current Derating EMI Performance Safety Considerations Layout Checklist/Example Typical Applications Appendix A Similarity Between PMBus, SMBus and I2C 2-Wire Interface Appendix B PMBus Serial Digital Interface Appendix C: PMBus Command Details Addressing and Write Protect General Configuration Registers On/Off/Margin PWM Config Voltage Current Temperature Timing Fault Response Fault Sharing Scratchpad Identification Fault Warning and Status Telemetry NVM (EEPROM) Memory Commands Package Description Package Photograph Package Description Revision History Typical Application Design Resources Related Parts