Datasheet LTM4634 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | Triple Output 5A/5A/4A Step-Down DC/DC μModule (Power Module) Regulator |
| 页数 / 页 | 32 / 2 — absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. … |
| 文件格式/大小 | PDF / 759 Kb |
| 文件语言 | 英语 |
absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
该数据表的模型线
文件文字版本
LTM4634
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
CNTL_PWR ... –0.3V to 30V TOP VIEW FREQ/PLLLPF V TKSS2 IN1, VIN2, VIN3 ... –0.3V to 30V COMP1 VFB1 GND TK/SS1 TK/SS3 VOUT1, VOUT2 ... –0.3V to 5.75V M PGOOD12 MODE/PLLIN COMP2 V V FB2 PGOOD3 RUN1 OUT3 ... –0.3V to 14V L EXTV RUN2 CC COMP3 V SGND Switch Voltage (SW1, SW2 and SW3) ...–1V to 30V FB3 K RUN3 GND GND MODE/PLLIN, TK/SS1, TK/SS2, TK/SS3, J INTVCC FREQ/PLLLPF ...–0.3V to INTV CNTL_PWR CC H VIN3 VIN2 GND V GND COMP1, COMP2, COMP3, V IN1 FB1, VFB2, VFB3 G (Note 3) ...–0.3V to INTVCC F RUN1, RUN2, RUN3, INTV SW3 SW1 CC, EXTVCC, E SW2 PGOOD12, PGOOD3 ... –0.3V to 6V GND D TEMP1, TEMP2 ... –0.3V to 0.8V C V INTV TEMP2 OUT2 TEMP1 CC Peak Output Current ..100mA B V V Operating Junction Temperature Range OUT3 OUT1 A (Note 2) .. –40°C to 125°C 1 2 3 4 5 6 7 8 9 10 11 12 GND GND Storage Temperature Range .. –55°C to 125°C BGA PACKAGE 144 LEAD (15mm × 15mm × 5.01mm) Peak Solder Reflow Body Temperature ... 245°C TJMAX = 125°C, θJA = 7.5°C/W, θJCbottom = 4°C/W, θJCtop = 5°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4-LAYER, WEIGHT = 3.2g θ VALUES DETERMINED PER JESD51-12
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (See Note 2)
LTM4634EY#PBF SAC305 (RoHS) LTM4634Y e1 BGA 4 –40°C to 125°C LTM4634IY#PBF SAC305 (RoHS) LTM4634Y e1 BGA 4 –40°C to 125°C LTM4634IY SnPb (63/37) LTM4634Y e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4634f 2 For more information www.linear.com/LTM4634 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Related Parts
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
CNTL_PWR ... –0.3V to 30V TOP VIEW FREQ/PLLLPF V TKSS2 IN1, VIN2, VIN3 ... –0.3V to 30V COMP1 VFB1 GND TK/SS1 TK/SS3 VOUT1, VOUT2 ... –0.3V to 5.75V M PGOOD12 MODE/PLLIN COMP2 V V FB2 PGOOD3 RUN1 OUT3 ... –0.3V to 14V L EXTV RUN2 CC COMP3 V SGND Switch Voltage (SW1, SW2 and SW3) ...–1V to 30V FB3 K RUN3 GND GND MODE/PLLIN, TK/SS1, TK/SS2, TK/SS3, J INTVCC FREQ/PLLLPF ...–0.3V to INTV CNTL_PWR CC H VIN3 VIN2 GND V GND COMP1, COMP2, COMP3, V IN1 FB1, VFB2, VFB3 G (Note 3) ...–0.3V to INTVCC F RUN1, RUN2, RUN3, INTV SW3 SW1 CC, EXTVCC, E SW2 PGOOD12, PGOOD3 ... –0.3V to 6V GND D TEMP1, TEMP2 ... –0.3V to 0.8V C V INTV TEMP2 OUT2 TEMP1 CC Peak Output Current ..100mA B V V Operating Junction Temperature Range OUT3 OUT1 A (Note 2) .. –40°C to 125°C 1 2 3 4 5 6 7 8 9 10 11 12 GND GND Storage Temperature Range .. –55°C to 125°C BGA PACKAGE 144 LEAD (15mm × 15mm × 5.01mm) Peak Solder Reflow Body Temperature ... 245°C TJMAX = 125°C, θJA = 7.5°C/W, θJCbottom = 4°C/W, θJCtop = 5°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4-LAYER, WEIGHT = 3.2g θ VALUES DETERMINED PER JESD51-12
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (See Note 2)
LTM4634EY#PBF SAC305 (RoHS) LTM4634Y e1 BGA 4 –40°C to 125°C LTM4634IY#PBF SAC305 (RoHS) LTM4634Y e1 BGA 4 –40°C to 125°C LTM4634IY SnPb (63/37) LTM4634Y e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4634f 2 For more information www.linear.com/LTM4634 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Related Parts