Datasheet LTM4618 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | 6A DC/DC μModule Regulator with Tracking and Frequency Synchronization |
| 页数 / 页 | 26 / 2 — absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. orDer inForMaTion. … |
| 文件格式/大小 | PDF / 635 Kb |
| 文件语言 | 英语 |
absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. orDer inForMaTion. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
该数据表的模型线
文件文字版本
LTM4618
absoluTe MaxiMuM raTings (Note 1)
VIN, SW .. –0.3V to 28V VOUT ... 0.8V to 5V INTVCC, RUN, EXTVCC, PGOOD .. –0.3V to 6V Internal Operating Temperature Range COMP, VFB ... –0.3V to 2.7V (Note 2) ..–40°C to 125°C MODE/PLLIN, TK/SS, Storage Temperature Range ...–55°C to 125°C FREQ ... –0.3V to INTVCC Peak Solder Reflow Body Temperature ... 245°C
pin conFiguraTion
TOP VIEW TOP VIEW SW SW 7 7 VIN VIN 6 PGND 6 PGND 5 5 EXTVCC EXTVCC 4 4 SGND/PGND SGND/PGND 3 MODE/ V 3 OUT MODE/ VOUT PLLIN PLLIN 2 2 FREQ FREQ RUN 1 RUN 1 A B C D E F G H J K L M A B C D E F G H J K L M TK/SS COMP V PGOOD FB INTVCC TK/SS COMP V PGOOD FB INTVCC LGA PACKAGE BGA PACKAGE 84-LEAD (15mm × 9mm × 4.32mm) 84-LEAD (15mm × 9mm × 4.92mm) ΘJA = 16°C/W, ΘJCtop = 18°C/W, ΘJCbottom = 4°C/W, WEIGHT = 1.7g, ΘJA = 16°C/W, ΘJCtop = 18°C/W, ΘJCbottom = 4°C/W, WEIGHT = 1.8g, θJB = 5°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH FOUR LAYERS θJB = 5°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH FOUR LAYERS
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4618EV#PBF Au (RoHS) LTM4618V e4 LGA 3 –40°C to 125°C LTM4618IV#PBF Au (RoHS) LTM4618V e4 LGA 3 –40°C to 125°C LTM4618EY#PBF SA305 (RoHS) LTM4618Y e1 BGA 3 –40°C to 125°C LTM4618IY#PBF SA305 (RoHS) LTM4618Y e1 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is identified by a label on the shipping Procedures: www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree 4618fb 2 For more information www.linear.com/LTM4618 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Photograph Package Description Revision History Typical Application Related Parts
absoluTe MaxiMuM raTings (Note 1)
VIN, SW .. –0.3V to 28V VOUT ... 0.8V to 5V INTVCC, RUN, EXTVCC, PGOOD .. –0.3V to 6V Internal Operating Temperature Range COMP, VFB ... –0.3V to 2.7V (Note 2) ..–40°C to 125°C MODE/PLLIN, TK/SS, Storage Temperature Range ...–55°C to 125°C FREQ ... –0.3V to INTVCC Peak Solder Reflow Body Temperature ... 245°C
pin conFiguraTion
TOP VIEW TOP VIEW SW SW 7 7 VIN VIN 6 PGND 6 PGND 5 5 EXTVCC EXTVCC 4 4 SGND/PGND SGND/PGND 3 MODE/ V 3 OUT MODE/ VOUT PLLIN PLLIN 2 2 FREQ FREQ RUN 1 RUN 1 A B C D E F G H J K L M A B C D E F G H J K L M TK/SS COMP V PGOOD FB INTVCC TK/SS COMP V PGOOD FB INTVCC LGA PACKAGE BGA PACKAGE 84-LEAD (15mm × 9mm × 4.32mm) 84-LEAD (15mm × 9mm × 4.92mm) ΘJA = 16°C/W, ΘJCtop = 18°C/W, ΘJCbottom = 4°C/W, WEIGHT = 1.7g, ΘJA = 16°C/W, ΘJCtop = 18°C/W, ΘJCbottom = 4°C/W, WEIGHT = 1.8g, θJB = 5°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH FOUR LAYERS θJB = 5°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH FOUR LAYERS
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4618EV#PBF Au (RoHS) LTM4618V e4 LGA 3 –40°C to 125°C LTM4618IV#PBF Au (RoHS) LTM4618V e4 LGA 3 –40°C to 125°C LTM4618EY#PBF SA305 (RoHS) LTM4618Y e1 BGA 3 –40°C to 125°C LTM4618IY#PBF SA305 (RoHS) LTM4618Y e1 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is identified by a label on the shipping Procedures: www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree 4618fb 2 For more information www.linear.com/LTM4618 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Photograph Package Description Revision History Typical Application Related Parts