Datasheet LTM8027 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | 60V, 4A DC/DC µModule Regulator |
| 页数 / 页 | 22 / 2 — ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION … |
| 文件格式/大小 | PDF / 636 Kb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION http://www.linear.com/product/LTM8027#orderinfo
该数据表的模型线
文件文字版本
LTM8027
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN Voltage ..65V Current Out of AUX ... 200mA BIAS1 ..15V Internal Operating Temperature (Note 3) BIAS2 ..24V E-, I-Grade ... –40°C to 125°C SYNC, ADJ, RT, RUN, SS Voltages ..5V MP-Grade .. –55°C to 125°C Current into RUN Pin (Note 2) ..1mA Peak Solder Reflow Body Temperature ... 245°C VOUT, AUX ...25V Storage Temperature Range .. –55°C to 125°C
PIN CONFIGURATION
TOP VIEW TOP VIEW 11 11 10 VOUT VOUT BANK 1 10 BANK 1 9 9 8 8 AUX 7 GND AUX 7 GND BIAS1 6 BANK 2 BIAS1 6 BANK 2 SS 5 SS 5 RUN 4 RUN 4 BIAS2 3 BIAS2 3 ADJ V 2 IN VIN BANK 3 ADJ 2 BANK 3 1 1 A B C D E F G H J K L A B C D E F G H J K L RT SYNC RT SYNC LGA PACKAGE BGA PACKAGE 113-LEAD (15mm × 15mm × 4.32mm) 113-LEAD (15mm × 15mm × 4.92mm) TJMAX = 125°C, θJA = 12.2°C/W, θJC(TOP) = 9.3°C/W, TJMAX = 125°C, θJA = 12.2°C/W, θJC(TOP) = 9.3°C/W, θJC(BOTTOM) = 3.6°C/W, θJBOARD = 7.54°C/W θJC(BOTTOM) = 3.6°C/W, θJBOARD = 7.54°C/W θ VALUES DETERMINED PER JESD 51-9 θ VALUES DETERMINED PER JESD 51-9 WEIGHT = 2.6 GRAMS WEIGHT = 2.6 GRAMS
ORDER INFORMATION http://www.linear.com/product/LTM8027#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (See Note 3) DEVICE FINISH CODE
LTM8027EV#PBF Au (RoHS) LTM8027V e4 LGA 3 –40°C to 125°C LTM8027IV#PBF Au (RoHS) LTM8027V e4 LGA 3 –40°C to 125°C LTM8027MPV#PBF Au (RoHS) LTM8027V e4 LGA 3 –55°C to 125°C LTM8027EY#PBF SAC305 (RoHS) LTM8027Y e1 BGA 3 –40°C to 125°C LTM8027IY#PBF SAC305 (RoHS) LTM8027Y e1 BGA 3 –40°C to 125°C LTM8027IY SnPb (63/37) LTM8027Y e0 BGA 3 –40°C to 125°C LTM8027MPY#PBF SAC305 (RoHS) LTM8027Y e1 BGA 3 –55°C to 125°C LTM8027MPY SnPb (63/37) LTM8027Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8027fd 2 For more information www.linear.com/LTM8027 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Photograph Package Description Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN Voltage ..65V Current Out of AUX ... 200mA BIAS1 ..15V Internal Operating Temperature (Note 3) BIAS2 ..24V E-, I-Grade ... –40°C to 125°C SYNC, ADJ, RT, RUN, SS Voltages ..5V MP-Grade .. –55°C to 125°C Current into RUN Pin (Note 2) ..1mA Peak Solder Reflow Body Temperature ... 245°C VOUT, AUX ...25V Storage Temperature Range .. –55°C to 125°C
PIN CONFIGURATION
TOP VIEW TOP VIEW 11 11 10 VOUT VOUT BANK 1 10 BANK 1 9 9 8 8 AUX 7 GND AUX 7 GND BIAS1 6 BANK 2 BIAS1 6 BANK 2 SS 5 SS 5 RUN 4 RUN 4 BIAS2 3 BIAS2 3 ADJ V 2 IN VIN BANK 3 ADJ 2 BANK 3 1 1 A B C D E F G H J K L A B C D E F G H J K L RT SYNC RT SYNC LGA PACKAGE BGA PACKAGE 113-LEAD (15mm × 15mm × 4.32mm) 113-LEAD (15mm × 15mm × 4.92mm) TJMAX = 125°C, θJA = 12.2°C/W, θJC(TOP) = 9.3°C/W, TJMAX = 125°C, θJA = 12.2°C/W, θJC(TOP) = 9.3°C/W, θJC(BOTTOM) = 3.6°C/W, θJBOARD = 7.54°C/W θJC(BOTTOM) = 3.6°C/W, θJBOARD = 7.54°C/W θ VALUES DETERMINED PER JESD 51-9 θ VALUES DETERMINED PER JESD 51-9 WEIGHT = 2.6 GRAMS WEIGHT = 2.6 GRAMS
ORDER INFORMATION http://www.linear.com/product/LTM8027#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (See Note 3) DEVICE FINISH CODE
LTM8027EV#PBF Au (RoHS) LTM8027V e4 LGA 3 –40°C to 125°C LTM8027IV#PBF Au (RoHS) LTM8027V e4 LGA 3 –40°C to 125°C LTM8027MPV#PBF Au (RoHS) LTM8027V e4 LGA 3 –55°C to 125°C LTM8027EY#PBF SAC305 (RoHS) LTM8027Y e1 BGA 3 –40°C to 125°C LTM8027IY#PBF SAC305 (RoHS) LTM8027Y e1 BGA 3 –40°C to 125°C LTM8027IY SnPb (63/37) LTM8027Y e0 BGA 3 –40°C to 125°C LTM8027MPY#PBF SAC305 (RoHS) LTM8027Y e1 BGA 3 –55°C to 125°C LTM8027MPY SnPb (63/37) LTM8027Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8027fd 2 For more information www.linear.com/LTM8027 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Photograph Package Description Revision History Typical Application Related Parts