Datasheet LTM4606 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | Ultralow EMI 28VIN, 6A DC/DC μModule Regulator |
| 页数 / 页 | 28 / 2 — absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. orDer inForMaTion. … |
| 文件格式/大小 | PDF / 616 Kb |
| 文件语言 | 英语 |
absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. orDer inForMaTion. PART NUMBER. PAD OR BALL FINISH. PART MARKING*. PACKAGE. MSL
该数据表的模型线
文件文字版本
LTM4606
absoluTe MaxiMuM raTings (Note 1)
DRVCC, VOUT .. –0.3V to 6V Internal Operating Temperature Range (Note 2) PLLIN, FCB, TRACK/SS, MPGM, MARG0, E and I Grades ... –40°C to 125°C MARG1, PGOOD, RUN ..–0.3V to INTVCC + 0.3V MP Grade ... –55°C to 125°C VFB, COMP .. –0.3V to 2.7V Junction Temperature ... 125°C VIN, VD ... –0.3V to 28V Storage Temperature Range .. –55°C to 125°C
pin conFiguraTion
TOP VIEW TOP VIEW V CC V CC INT PLLIN TRACK/SS RUN COMP MPGM INT PLLIN TRACK/SS RUN COMP MPGM VIN f VIN BANK 1 f V SET SET D BANK 1 V MARG0 D MARG0 SGND MARG1 SGND MARG1 DRVCC DRVCC PGND V PGND FB V BANK 2 FB BANK 2 PGOOD PGOOD SGND SGND NC NC VOUT NC V NC OUT BANK 3 NC BANK 3 NC FCB FCB BGA PACKAGE LGA PACKAGE 133-LEAD (15mm × 15mm × 3.42mm) 133-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15°C/W, θJCbottom = 6°C/W, θJCtop = 16°C/W TJMAX = 125°C, θJA = 15°C/W, θJCbottom = 6°C/W, θJCtop = 16°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.9g WEIGHT = 1.7g
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4606EV#PBF Au (RoHS) LTM4606V e4 LGA 3 –40°C to 125°C LTM4606IV#PBF Au (RoHS) LTM4606V e4 LGA 3 –40°C to 125°C LTM4606MPV#PBF Au (RoHS) LTM4606V e4 LGA 3 –55°C to 125°C LTM4606EY#PBF SAC305 (RoHS) LTM4606Y e1 BGA 3 –40°C to 125°C LTM4606IY#PBF SAC305 (RoHS) LTM4606Y e1 BGA 3 –40°C to 125°C LTM4606IY SnPb (63/37) LTM4606Y e0 BGA 3 –40°C to 125°C LTM4606MPY#PBF SAC305 (RoHS) LTM4606Y e1 BGA 3 –55°C to 125°C LTM4606MPY SnPb (63/37) LTM4606Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4606fd 2 For more information www.linear.com/LTM4606 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photograph Related Parts
absoluTe MaxiMuM raTings (Note 1)
DRVCC, VOUT .. –0.3V to 6V Internal Operating Temperature Range (Note 2) PLLIN, FCB, TRACK/SS, MPGM, MARG0, E and I Grades ... –40°C to 125°C MARG1, PGOOD, RUN ..–0.3V to INTVCC + 0.3V MP Grade ... –55°C to 125°C VFB, COMP .. –0.3V to 2.7V Junction Temperature ... 125°C VIN, VD ... –0.3V to 28V Storage Temperature Range .. –55°C to 125°C
pin conFiguraTion
TOP VIEW TOP VIEW V CC V CC INT PLLIN TRACK/SS RUN COMP MPGM INT PLLIN TRACK/SS RUN COMP MPGM VIN f VIN BANK 1 f V SET SET D BANK 1 V MARG0 D MARG0 SGND MARG1 SGND MARG1 DRVCC DRVCC PGND V PGND FB V BANK 2 FB BANK 2 PGOOD PGOOD SGND SGND NC NC VOUT NC V NC OUT BANK 3 NC BANK 3 NC FCB FCB BGA PACKAGE LGA PACKAGE 133-LEAD (15mm × 15mm × 3.42mm) 133-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15°C/W, θJCbottom = 6°C/W, θJCtop = 16°C/W TJMAX = 125°C, θJA = 15°C/W, θJCbottom = 6°C/W, θJCtop = 16°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.9g WEIGHT = 1.7g
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4606EV#PBF Au (RoHS) LTM4606V e4 LGA 3 –40°C to 125°C LTM4606IV#PBF Au (RoHS) LTM4606V e4 LGA 3 –40°C to 125°C LTM4606MPV#PBF Au (RoHS) LTM4606V e4 LGA 3 –55°C to 125°C LTM4606EY#PBF SAC305 (RoHS) LTM4606Y e1 BGA 3 –40°C to 125°C LTM4606IY#PBF SAC305 (RoHS) LTM4606Y e1 BGA 3 –40°C to 125°C LTM4606IY SnPb (63/37) LTM4606Y e0 BGA 3 –40°C to 125°C LTM4606MPY#PBF SAC305 (RoHS) LTM4606Y e1 BGA 3 –55°C to 125°C LTM4606MPY SnPb (63/37) LTM4606Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4606fd 2 For more information www.linear.com/LTM4606 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photograph Related Parts