Datasheet LTC4364-1, LTC4364-2 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | Surge Stopper with Ideal Diode |
| 页数 / 页 | 24 / 7 — PIN FUNCTIONS. DGATE:. OUT:. OV:. ENOUT:. SENSE:. Exposed Pad (DE Package … |
| 文件格式/大小 | PDF / 314 Kb |
| 文件语言 | 英语 |
PIN FUNCTIONS. DGATE:. OUT:. OV:. ENOUT:. SENSE:. Exposed Pad (DE Package Only):. FB:. FLT:. SHDN:. GND:. SOURCE:. HGATE:
该数据表的模型线
- LTC4364CDE-1#PBF LTC4364CDE-1#TRPBF LTC4364CDE-2#PBF LTC4364CDE-2#TRPBF LTC4364CMS-1#PBF LTC4364CMS-1#TRPBF LTC4364CMS-2#PBF LTC4364CMS-2#TRPBF LTC4364CS-1#PBF LTC4364CS-1#TRPBF LTC4364CS-2#PBF LTC4364CS-2#TRPBF LTC4364HDE-1#PBF LTC4364HDE-1#TRPBF LTC4364HDE-2#PBF LTC4364HDE-2#TRPBF LTC4364HMS-1#PBF LTC4364HMS-1#TRPBF LTC4364HMS-2#PBF LTC4364HMS-2#TRPBF LTC4364HS-1#PBF LTC4364HS-1#TRPBF LTC4364HS-2#PBF LTC4364HS-2#TRPBF LTC4364IDE-1#PBF LTC4364IDE-1#TRPBF LTC4364IDE-2#PBF LTC4364IDE-2#TRPBF LTC4364IMS-1#PBF LTC4364IMS-1#TRPBF LTC4364IMS-2#PBF LTC4364IMS-2#TRPBF LTC4364IS-1#PBF LTC4364IS-1#TRPBF LTC4364IS-2#PBF LTC4364IS-2#TRPBF
文件文字版本
LTC4364-1/LTC4364-2
PIN FUNCTIONS DGATE:
Diode Controller Gate Drive Output. When the load
OUT:
Output Voltage Sense Input. This pin senses the current creates more than 30mV of drop across the MOSFET, voltage at the drain of the external N-channel MOSFET the DGATE pin is pulled high by an internal charge pump connected to the DGATE pin. The voltage difference current source and clamped to 12V above the SOURCE pin. between VCC and OUT sets the fault timer current. When When the load current is small, the DGATE pin is actively this difference drops below 0.7V, the ENOUT pin goes driven to maintain 30mV across the MOSFET. If reverse high impedance. current develops, a 130mA fast pull-down circuit quickly
OV:
Overvoltage Comparator Input. When OV is above connects the DGATE pin to the SOURCE pin, turning off its threshold of 1.25V, the fault retry function is inhibited. the MOSFET. Connect to SOURCE or leave open if unused. When OV falls below its threshold, the HGATE pin is al-
ENOUT:
Enable Output. An open-drain output that goes lowed to turn back on when fault conditions are cleared. At high impedance when the voltage at the OUT pin is above power-up, an OV voltage higher than its threshold blocks (VCC − 0.7V), indicating the external MOSFETs are fully turn-on of the external N-channel MOSFET controlled by on. The state of the pin is latched and resets when the the HGATE pin (see Applications Information). Connect OUT pin drops below 2.2V. The internal FET is capable of to GND if unused. sinking up to 2mA and can withstand up to 80V. Connect
SENSE:
Current Sense Input. Connect this pin to the input to GND if unused. side of the current sense resistor. The current limit circuit
Exposed Pad (DE Package Only):
Exposed pad may be controls the HGATE pin to limit the sense voltage between left open or connected to device ground (GND). the SENSE and OUT pins to 50mV if OUT is above 2.5V.
FB:
Voltage Regulator Feedback Input. Connect this pin to When OUT drops below 1.5V, the sense voltage is reduced the resistive divider connected between the OUT pin and to 25mV for additional protection during an output short. ground. During an overvoltage condition, the HGATE pin The sense amplifier also starts a current source to charge is controlled to maintain 1.25V at the FB pin. Connect to up the TMR pin. The voltage difference between SENSE GND to disable the overvoltage clamp. and OUT must be limited to less than 30V. Connect to OUT if unused.
FLT:
Fault Output. An open-drain output that pulls low after the TMR pin reaches the warning threshold of 1.25V.
SHDN:
Shutdown Control Input. Pulling the SHDN pin It indicates the pass device controlled by the HGATE pin below 0.5V shuts off the LTC4364 and reduces the VCC pin is about to turn off because either the supply voltage has current to 10μA. Pull this pin above 2.2V or disconnect it stayed at an elevated level for an extended period of time to allow the internal current source to turn the part back (overvoltage fault) or the device is in an overcurrent con- on. When left open, the SHDN voltage is internally clamped dition (overcurrent fault). The internal FET is capable of to 4V. The leakage current to ground at the pin should be sinking up to 2mA and can withstand up to 80V. Connect limited to no more than 1μA if no pull-up device is used to to GND if unused. turn the part on. The SHDN pin can be pulled up to 100V or below GND by 40V without damage.
GND:
Device Ground.
SOURCE:
Common Source Input and Gate Drive Return.
HGATE:
Surge Stopper Gate Drive Output. The HGATE pin Connect this pin directly to the sources of the external is pulled up by an internal charge pump current source and back-to-back N-channel MOSFETs. SOURCE is the anode clamped to 12V above the SOURCE pin. Both voltage and of the ideal diode and the voltage sensed between this pin current amplifiers control the HGATE pin to regulate the and the SENSE pin is used to control the source-drain output voltage and limit the current through the MOSFET. voltage across the N-channel MOSFET (forward voltage of the ideal diode). 436412f 7 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts
PIN FUNCTIONS DGATE:
Diode Controller Gate Drive Output. When the load
OUT:
Output Voltage Sense Input. This pin senses the current creates more than 30mV of drop across the MOSFET, voltage at the drain of the external N-channel MOSFET the DGATE pin is pulled high by an internal charge pump connected to the DGATE pin. The voltage difference current source and clamped to 12V above the SOURCE pin. between VCC and OUT sets the fault timer current. When When the load current is small, the DGATE pin is actively this difference drops below 0.7V, the ENOUT pin goes driven to maintain 30mV across the MOSFET. If reverse high impedance. current develops, a 130mA fast pull-down circuit quickly
OV:
Overvoltage Comparator Input. When OV is above connects the DGATE pin to the SOURCE pin, turning off its threshold of 1.25V, the fault retry function is inhibited. the MOSFET. Connect to SOURCE or leave open if unused. When OV falls below its threshold, the HGATE pin is al-
ENOUT:
Enable Output. An open-drain output that goes lowed to turn back on when fault conditions are cleared. At high impedance when the voltage at the OUT pin is above power-up, an OV voltage higher than its threshold blocks (VCC − 0.7V), indicating the external MOSFETs are fully turn-on of the external N-channel MOSFET controlled by on. The state of the pin is latched and resets when the the HGATE pin (see Applications Information). Connect OUT pin drops below 2.2V. The internal FET is capable of to GND if unused. sinking up to 2mA and can withstand up to 80V. Connect
SENSE:
Current Sense Input. Connect this pin to the input to GND if unused. side of the current sense resistor. The current limit circuit
Exposed Pad (DE Package Only):
Exposed pad may be controls the HGATE pin to limit the sense voltage between left open or connected to device ground (GND). the SENSE and OUT pins to 50mV if OUT is above 2.5V.
FB:
Voltage Regulator Feedback Input. Connect this pin to When OUT drops below 1.5V, the sense voltage is reduced the resistive divider connected between the OUT pin and to 25mV for additional protection during an output short. ground. During an overvoltage condition, the HGATE pin The sense amplifier also starts a current source to charge is controlled to maintain 1.25V at the FB pin. Connect to up the TMR pin. The voltage difference between SENSE GND to disable the overvoltage clamp. and OUT must be limited to less than 30V. Connect to OUT if unused.
FLT:
Fault Output. An open-drain output that pulls low after the TMR pin reaches the warning threshold of 1.25V.
SHDN:
Shutdown Control Input. Pulling the SHDN pin It indicates the pass device controlled by the HGATE pin below 0.5V shuts off the LTC4364 and reduces the VCC pin is about to turn off because either the supply voltage has current to 10μA. Pull this pin above 2.2V or disconnect it stayed at an elevated level for an extended period of time to allow the internal current source to turn the part back (overvoltage fault) or the device is in an overcurrent con- on. When left open, the SHDN voltage is internally clamped dition (overcurrent fault). The internal FET is capable of to 4V. The leakage current to ground at the pin should be sinking up to 2mA and can withstand up to 80V. Connect limited to no more than 1μA if no pull-up device is used to to GND if unused. turn the part on. The SHDN pin can be pulled up to 100V or below GND by 40V without damage.
GND:
Device Ground.
SOURCE:
Common Source Input and Gate Drive Return.
HGATE:
Surge Stopper Gate Drive Output. The HGATE pin Connect this pin directly to the sources of the external is pulled up by an internal charge pump current source and back-to-back N-channel MOSFETs. SOURCE is the anode clamped to 12V above the SOURCE pin. Both voltage and of the ideal diode and the voltage sensed between this pin current amplifiers control the HGATE pin to regulate the and the SENSE pin is used to control the source-drain output voltage and limit the current through the MOSFET. voltage across the N-channel MOSFET (forward voltage of the ideal diode). 436412f 7 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts