Datasheet ADP5091, ADP5092 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | Ultralow Power Energy Harvester PMU with MPPT and Charge Management |
| 页数 / 页 | 28 / 7 — Data Sheet. ADP5091/ADP5092. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| 修订版 | A |
| 文件格式/大小 | PDF / 931 Kb |
| 文件语言 | 英语 |
Data Sheet. ADP5091/ADP5092. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Package Type. θJC. Unit
该数据表的模型线
文件文字版本
Data Sheet ADP5091/ADP5092 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
θJA is specified for the worst case conditions, that is, a device VIN, MPPT, CBP, MINOP −0.3 V to +3.6 V soldered in a circuit board for surface-mount packages. DIS_SW, TERM, SETPG, SETSD, SETBK, −0.3 V to +6.0 V
Table 4.
PGOOD, SETHYST, REF, REG_D0, VID,
Package Type θ
REG_D1, LLD, REG_GOOD to AGND
JA θJC Unit
SW, SYS, BAT, BACK_UP, REG_OUT, REG_FB −0.3 V to +6.0 V 24-Lead LFCSP 58.7 36 °C/W to PGND PGND to AGND −0.3 V to +0.3 V
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 7 of 28 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION REVISION HISTORY DETAILED FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS REGULATED OUTPUT SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION FAST COLD START-UP CIRCUIT (VSYS < VSYS_TH, VIN > VIN_COLD) MAIN BOOST REGULATOR (VBAT_TERM > VSYS > VSYS_TH) VIN OPEN CIRCUIT AND MPPT MINIMUM OPERATION THRESHOLD FUNCTION DISABLING BOOST REGULATED OUTPUT WORKING MODE REG_D0 AND REG_D1 REGULATED OUTPUT CONFIGURATION REG_GOOD (ADP5092 ONLY) ENERGY STORAGE CHARGE MANAGEMENT BACKUP STORAGE PATH BACKUP AND BAT SELECTION THRESHOLD BATTERY OVERCHARGING PROTECTION BATTERY DISCHARGING PROTECTION POWER GOOD (PGOOD) POWER PATH WORKING FLOW CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTION THERMAL SHUTDOWN APPLICATIONS INFORMATION ENERGY HARVESTER SELECTION ENERGY STORAGE ELEMENT SELECTION INDUCTOR SELECTION CAPACITOR SELECTION Input Capacitor SYS Capacitor REG_OUT Capacitor CBP Capacitor LAYOUT AND ASSEMBLY CONSIDERATIONS TYPICAL APPLICATION CIRCUITS FACTORY PROGRAMMABLE OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst case conditions, that is, a device VIN, MPPT, CBP, MINOP −0.3 V to +3.6 V soldered in a circuit board for surface-mount packages. DIS_SW, TERM, SETPG, SETSD, SETBK, −0.3 V to +6.0 V
Table 4.
PGOOD, SETHYST, REF, REG_D0, VID,
Package Type θ
REG_D1, LLD, REG_GOOD to AGND
JA θJC Unit
SW, SYS, BAT, BACK_UP, REG_OUT, REG_FB −0.3 V to +6.0 V 24-Lead LFCSP 58.7 36 °C/W to PGND PGND to AGND −0.3 V to +0.3 V
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 7 of 28 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION REVISION HISTORY DETAILED FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS REGULATED OUTPUT SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION FAST COLD START-UP CIRCUIT (VSYS < VSYS_TH, VIN > VIN_COLD) MAIN BOOST REGULATOR (VBAT_TERM > VSYS > VSYS_TH) VIN OPEN CIRCUIT AND MPPT MINIMUM OPERATION THRESHOLD FUNCTION DISABLING BOOST REGULATED OUTPUT WORKING MODE REG_D0 AND REG_D1 REGULATED OUTPUT CONFIGURATION REG_GOOD (ADP5092 ONLY) ENERGY STORAGE CHARGE MANAGEMENT BACKUP STORAGE PATH BACKUP AND BAT SELECTION THRESHOLD BATTERY OVERCHARGING PROTECTION BATTERY DISCHARGING PROTECTION POWER GOOD (PGOOD) POWER PATH WORKING FLOW CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTION THERMAL SHUTDOWN APPLICATIONS INFORMATION ENERGY HARVESTER SELECTION ENERGY STORAGE ELEMENT SELECTION INDUCTOR SELECTION CAPACITOR SELECTION Input Capacitor SYS Capacitor REG_OUT Capacitor CBP Capacitor LAYOUT AND ASSEMBLY CONSIDERATIONS TYPICAL APPLICATION CIRCUITS FACTORY PROGRAMMABLE OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE