Datasheet ADP5090 (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | Ultralow Power Boost Regulator with MPPT and Charge Management |
| 页数 / 页 | 21 / 4 — ADP5090. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| 修订版 | C |
| 文件格式/大小 | PDF / 634 Kb |
| 文件语言 | 英语 |
ADP5090. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Package Type. θJA. θJC. Unit
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ADP5090 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst case conditions, that is, a device VIN, MPPT, CBP, MINOP −0.3 V to +3.6 V soldered in a circuit board for surface-mount packages. DIS_SW, TERM, SETPG, SETSD, PGOOD, REF to −0.3 V to +6.0 V AGND
Table 3.
SW, SYS, BAT, BACK_UP to PGND −2.0 V to +6.0 V
Package Type θJA θJC Unit
PGND to GND −0.3 V to +0.3 V 16-Lead LFCSP 53.1 4.55 °C/W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 4 of 21 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS DETAILED FUNCTIONAL BLOCK DIAGRAM THEORY OF OPERATION COLD STARTUP (VSYS < VSYS_TH, VIN > VIN_COLD) BOOST REGULATOR (VBAT_TERM > VSYS ≥ VSYS_TH) VIN OPEN CIRCUIT AND MPPT ENERGY STORAGE CHARGE MANAGEMENT BACKUP STORAGE PATH MINOP FUNCTION DISABLING BOOST BATTERY OVERCHARGING PROTECTION BATTERY DISCHARGING PROTECTION POWER GOOD (PGOOD) POWER PATH WORKING FLOW CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTION THERMAL SHUTDOWN APPLICATIONS INFORMATION ENERGY HARVESTER SELECTION ENERGY STORAGE ELEMENT SELECTION INDUCTOR SELECTION CAPACITOR SELECTION Input Capacitor SYS Capacitor CBP Capacitor LAYOUT AND ASSEMBLY CONSIDERATIONS TYPICAL APPLICATION CIRCUITS FACTORY PROGRAMMABLE OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst case conditions, that is, a device VIN, MPPT, CBP, MINOP −0.3 V to +3.6 V soldered in a circuit board for surface-mount packages. DIS_SW, TERM, SETPG, SETSD, PGOOD, REF to −0.3 V to +6.0 V AGND
Table 3.
SW, SYS, BAT, BACK_UP to PGND −2.0 V to +6.0 V
Package Type θJA θJC Unit
PGND to GND −0.3 V to +0.3 V 16-Lead LFCSP 53.1 4.55 °C/W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 4 of 21 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS DETAILED FUNCTIONAL BLOCK DIAGRAM THEORY OF OPERATION COLD STARTUP (VSYS < VSYS_TH, VIN > VIN_COLD) BOOST REGULATOR (VBAT_TERM > VSYS ≥ VSYS_TH) VIN OPEN CIRCUIT AND MPPT ENERGY STORAGE CHARGE MANAGEMENT BACKUP STORAGE PATH MINOP FUNCTION DISABLING BOOST BATTERY OVERCHARGING PROTECTION BATTERY DISCHARGING PROTECTION POWER GOOD (PGOOD) POWER PATH WORKING FLOW CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTION THERMAL SHUTDOWN APPLICATIONS INFORMATION ENERGY HARVESTER SELECTION ENERGY STORAGE ELEMENT SELECTION INDUCTOR SELECTION CAPACITOR SELECTION Input Capacitor SYS Capacitor CBP Capacitor LAYOUT AND ASSEMBLY CONSIDERATIONS TYPICAL APPLICATION CIRCUITS FACTORY PROGRAMMABLE OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE