Datasheet LT1571 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | Constant-Current/Constant-Voltage Battery Charger with Preset Voltage and Termination Flag |
| 页数 / 页 | 16 / 2 — ABSOLUTE AXI U RATI GS (Note 1). PACKAGE/ORDER I FOR ATIO |
| 文件格式/大小 | PDF / 220 Kb |
| 文件语言 | 英语 |
ABSOLUTE AXI U RATI GS (Note 1). PACKAGE/ORDER I FOR ATIO
该数据表的模型线
文件文字版本
LT1571 Series
W W W U ABSOLUTE AXI U RATI GS (Note 1)
Supply Voltage (VCC) .. 28V Operating Ambient BOOST Pin Voltage with Respect to VCC ... 20V Temperature Range (Note 2) .. – 40°C to 85°C FLAG Pin Voltage ... VCC Operating Junction IBAT (Average).. 1.5A Temperature Range .. – 40°C to 125°C Switch Current (Peak) .. 2A Lead Temperature (Soldering, 10 sec).. 300°C Storage Temperature Range ... – 65°C to 150°C
U W U PACKAGE/ORDER I FOR ATIO
TOP VIEW TOP VIEW **GND 1 28 GND** **GND 1 28 GND** **GND 2 27 GND** **GND 2 27 GND** TOP VIEW **GND 3 26 GND** **GND 3 26 GND** **GND 1 16 GND** SW 4 25 GND** SW 4 25 GND** SW 2 15 VCC1* BOOST 5 24 V BOOST 5 24 V CC1* CC1* BOOST 3 14 VCC2* NC 6 23 V BAT2 6 23 V CC2* CC2* BAT2 4 13 CAP FLAG 7 22 CAP FLAG 7 22 CAP FLAG 5 12 PROG NC 8 21 PROG NC 8 21 PROG SELECT 6 11 VC V 9 20 V SELECT 9 20 V C C FB SENSE 7 10 BAT SENSE 10 19 BAT SENSE 10 19 BAT **GND 8 9 GND** **GND 11 18 GND** **GND 11 18 GND** GN PACKAGE **GND 12 17 GND** **GND 12 17 GND** 16-LEAD NARROW PLASTIC SSOP **GND 13 16 GND** **GND 13 16 GND** TJMAX = 125°C, θJA = 75°C/ W **GND 14 15 GND** **GND 14 15 GND** * VCC1 AND VCC2 SHOULD BE CONNECTED GN PACKAGE GN PACKAGE TOGETHER CLOSE TO THE PINS 28-LEAD NARROW PLASTIC SSOP 28-LEAD NARROW PLASTIC SSOP ** FOUR CORNER PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR TJMAX = 125°C, θJA = 40°C/ W TJMAX = 125°C, θJA = 40°C/ W HEAT SINKING. CONNECT THESE FOUR PINS TO EXPANDED PC LANDS FOR * VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER * VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER PROPER HEAT SINKING CLOSE TO THE PINS CLOSE TO THE PINS ** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH ** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO EXPANDED PC LANDS FOR PROPER HEAT SINKING EXPANDED PC LANDS FOR PROPER HEAT SINKING 40°C/W THERMAL RESISTANCE ASSUMES AN INTERNAL 40°C/W THERMAL RESISTANCE ASSUMES AN INTERNAL GROUND PLANE DOUBLING AS A HEAT SPREADER GROUND PLANE DOUBLING AS A HEAT SPREADER ORDER PART NUMBER ORDER PART NUMBER ORDER PART NUMBER LT1571EGN-5 LT1571EGN-1 LT1571EGN-2 Consult factory for Industrial and Military grade parts. 2
W W W U ABSOLUTE AXI U RATI GS (Note 1)
Supply Voltage (VCC) .. 28V Operating Ambient BOOST Pin Voltage with Respect to VCC ... 20V Temperature Range (Note 2) .. – 40°C to 85°C FLAG Pin Voltage ... VCC Operating Junction IBAT (Average).. 1.5A Temperature Range .. – 40°C to 125°C Switch Current (Peak) .. 2A Lead Temperature (Soldering, 10 sec).. 300°C Storage Temperature Range ... – 65°C to 150°C
U W U PACKAGE/ORDER I FOR ATIO
TOP VIEW TOP VIEW **GND 1 28 GND** **GND 1 28 GND** **GND 2 27 GND** **GND 2 27 GND** TOP VIEW **GND 3 26 GND** **GND 3 26 GND** **GND 1 16 GND** SW 4 25 GND** SW 4 25 GND** SW 2 15 VCC1* BOOST 5 24 V BOOST 5 24 V CC1* CC1* BOOST 3 14 VCC2* NC 6 23 V BAT2 6 23 V CC2* CC2* BAT2 4 13 CAP FLAG 7 22 CAP FLAG 7 22 CAP FLAG 5 12 PROG NC 8 21 PROG NC 8 21 PROG SELECT 6 11 VC V 9 20 V SELECT 9 20 V C C FB SENSE 7 10 BAT SENSE 10 19 BAT SENSE 10 19 BAT **GND 8 9 GND** **GND 11 18 GND** **GND 11 18 GND** GN PACKAGE **GND 12 17 GND** **GND 12 17 GND** 16-LEAD NARROW PLASTIC SSOP **GND 13 16 GND** **GND 13 16 GND** TJMAX = 125°C, θJA = 75°C/ W **GND 14 15 GND** **GND 14 15 GND** * VCC1 AND VCC2 SHOULD BE CONNECTED GN PACKAGE GN PACKAGE TOGETHER CLOSE TO THE PINS 28-LEAD NARROW PLASTIC SSOP 28-LEAD NARROW PLASTIC SSOP ** FOUR CORNER PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR TJMAX = 125°C, θJA = 40°C/ W TJMAX = 125°C, θJA = 40°C/ W HEAT SINKING. CONNECT THESE FOUR PINS TO EXPANDED PC LANDS FOR * VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER * VCC1 AND VCC2 SHOULD BE CONNECTED TOGETHER PROPER HEAT SINKING CLOSE TO THE PINS CLOSE TO THE PINS ** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH ** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO EXPANDED PC LANDS FOR PROPER HEAT SINKING EXPANDED PC LANDS FOR PROPER HEAT SINKING 40°C/W THERMAL RESISTANCE ASSUMES AN INTERNAL 40°C/W THERMAL RESISTANCE ASSUMES AN INTERNAL GROUND PLANE DOUBLING AS A HEAT SPREADER GROUND PLANE DOUBLING AS A HEAT SPREADER ORDER PART NUMBER ORDER PART NUMBER ORDER PART NUMBER LT1571EGN-5 LT1571EGN-1 LT1571EGN-2 Consult factory for Industrial and Military grade parts. 2