Datasheet LT1769 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | Constant-Current/Constant-Voltage 2A Battery Charger with Input Current Limiting |
| 页数 / 页 | 16 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PACKAGE/ORDER INFORMATION. ELECTRICAL … |
| 文件格式/大小 | PDF / 243 Kb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS (Note 1). PACKAGE/ORDER INFORMATION. ELECTRICAL CHARACTERISTICS The
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LT1769
W W W U ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage Operating Ambient Temperature (VCC, CLP and CLN Pin Voltage) ... 30V Commercial .. 0°C to 70°C BOOST Pin Voltage with Respect to VCC ... 25V Industrial ... – 40°C to 85°C IBAT (Average)... 2A Storage Temperature Range ... – 65°C to 150°C Operating Junction Temperature Range Lead Temperature (Soldering, 10 sec).. 300°C Commercial ... 0°C to 125°C Industrial ... – 40°C to 125°C
U W U PACKAGE/ORDER INFORMATION
TOP VIEW ORDER PART ORDER PART NUMBER TOP VIEW NUMBER GND** 1 28 GND** SW 1 20 GND GND** 2 27 GND** LT1769CGN LT1769CFE BOOST 2 19 V GND** 3 26 GND** CC1 LT1769IGN LT1769IFE UV 3 18 V SW 4 25 V CC2 CC1* GND 4 17 V BOOST 5 24 V CC3 CC2* GND 5 16 PROG UV 6 23 VCC3* OVP 6 15 V GND** 7 22 GND** C *ALL VCC PINS SHOULD CLN 7 14 GND GND** 8 21 PROG BE CONNECTED TOGETHER CLOSE TO CLP 8 13 UV OVP 9 20 V OUT C THE PINS ** ALL GND PINS ARE COMP1 9 12 BAT CLP 10 19 UVOUT FUSED TO INTERNAL DIE SENSE 10 11 SPIN CLN 11 18 COMP2 ATTACH PADDLE FOR HEAT SINKING. CONNECT COMP1 12 17 BAT FE PACKAGE THESE PINS TO †THE BOTTOM METAL 20-LEAD PLASTIC TSSOP SENSE 13 16 SPIN EXPANDED PC LANDS PLATE OF THIS PACKAGE FOR PROPER HEAT TJMAX = 125°C, θJA = 35°C/ W† IS FUSED TO INTERNAL GND** 14 15 GND** SINKING. 35°C/W GROUND AND IS FOR EXPOSED PAD IS GROUND THERMAL RESISTANCE HEAT SINKING. SOLDER (MUST BE SOLDERED TO PCB) GN PACKAGE ASSUMES AN INTERNAL THE BOTTOM METAL 28-LEAD PLASTIC SSOP GROUND PLANE 3.0 PLATE ONTO PCB EXPOSED PAD SIZE: × 4.1 DOUBLING AS A HEAT (.188) (.162) T GROUND PLANE FOR JMAX = 125°C, θJA = 35°C/ W** SPREADER HEAT SINKING. Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS The
●
denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25
°
C. VCC = 16V, VBAT = 8V, RS2 = RS3 = 200
Ω
(see Block Diagram), VCLN = VCC. No load on any outputs unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS Overall
Supply Current VPROG = 2.7V, VCC ≤ 20V ● 4.5 6.8 mA VPROG = 2.7V, 20V < VCC ≤ 25V ● 4.6 7.0 mA Sense Amplifier CA1 Gain and Input Offset Voltage 8V ≤ VCC ≤ 25V , 0V ≤ VBAT ≤ 20V (With RS2 = 200Ω, RS3 = 200Ω) RPROG = 4.93k ● 93 100 107 mV (Measured across RS1)(Note 2) RPROG = 49.3k ● 8 10 12 mV TA < 0°C 7 13 mV VCC = 28V, VBAT = 20V RPROG = 4.93k ● 90 110 mV RPROG = 49.3k ● 7 13 mV TA < 0°C 6 14 mV 1769fa 2
W W W U ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage Operating Ambient Temperature (VCC, CLP and CLN Pin Voltage) ... 30V Commercial .. 0°C to 70°C BOOST Pin Voltage with Respect to VCC ... 25V Industrial ... – 40°C to 85°C IBAT (Average)... 2A Storage Temperature Range ... – 65°C to 150°C Operating Junction Temperature Range Lead Temperature (Soldering, 10 sec).. 300°C Commercial ... 0°C to 125°C Industrial ... – 40°C to 125°C
U W U PACKAGE/ORDER INFORMATION
TOP VIEW ORDER PART ORDER PART NUMBER TOP VIEW NUMBER GND** 1 28 GND** SW 1 20 GND GND** 2 27 GND** LT1769CGN LT1769CFE BOOST 2 19 V GND** 3 26 GND** CC1 LT1769IGN LT1769IFE UV 3 18 V SW 4 25 V CC2 CC1* GND 4 17 V BOOST 5 24 V CC3 CC2* GND 5 16 PROG UV 6 23 VCC3* OVP 6 15 V GND** 7 22 GND** C *ALL VCC PINS SHOULD CLN 7 14 GND GND** 8 21 PROG BE CONNECTED TOGETHER CLOSE TO CLP 8 13 UV OVP 9 20 V OUT C THE PINS ** ALL GND PINS ARE COMP1 9 12 BAT CLP 10 19 UVOUT FUSED TO INTERNAL DIE SENSE 10 11 SPIN CLN 11 18 COMP2 ATTACH PADDLE FOR HEAT SINKING. CONNECT COMP1 12 17 BAT FE PACKAGE THESE PINS TO †THE BOTTOM METAL 20-LEAD PLASTIC TSSOP SENSE 13 16 SPIN EXPANDED PC LANDS PLATE OF THIS PACKAGE FOR PROPER HEAT TJMAX = 125°C, θJA = 35°C/ W† IS FUSED TO INTERNAL GND** 14 15 GND** SINKING. 35°C/W GROUND AND IS FOR EXPOSED PAD IS GROUND THERMAL RESISTANCE HEAT SINKING. SOLDER (MUST BE SOLDERED TO PCB) GN PACKAGE ASSUMES AN INTERNAL THE BOTTOM METAL 28-LEAD PLASTIC SSOP GROUND PLANE 3.0 PLATE ONTO PCB EXPOSED PAD SIZE: × 4.1 DOUBLING AS A HEAT (.188) (.162) T GROUND PLANE FOR JMAX = 125°C, θJA = 35°C/ W** SPREADER HEAT SINKING. Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS The
●
denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25
°
C. VCC = 16V, VBAT = 8V, RS2 = RS3 = 200
Ω
(see Block Diagram), VCLN = VCC. No load on any outputs unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS Overall
Supply Current VPROG = 2.7V, VCC ≤ 20V ● 4.5 6.8 mA VPROG = 2.7V, 20V < VCC ≤ 25V ● 4.6 7.0 mA Sense Amplifier CA1 Gain and Input Offset Voltage 8V ≤ VCC ≤ 25V , 0V ≤ VBAT ≤ 20V (With RS2 = 200Ω, RS3 = 200Ω) RPROG = 4.93k ● 93 100 107 mV (Measured across RS1)(Note 2) RPROG = 49.3k ● 8 10 12 mV TA < 0°C 7 13 mV VCC = 28V, VBAT = 20V RPROG = 4.93k ● 90 110 mV RPROG = 49.3k ● 7 13 mV TA < 0°C 6 14 mV 1769fa 2