Datasheet LT1034-1.2, LT1034-2.5 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | Micropower Dual Reference |
| 页数 / 页 | 8 / 6 — PACKAGE DESCRIPTIO. H Package. 8-Lead TO-5 Metal Can (.200 Inch PCD). … |
| 文件格式/大小 | PDF / 108 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTIO. H Package. 8-Lead TO-5 Metal Can (.200 Inch PCD). OBSOLETE PACKAGE. S8 Package
该数据表的模型线
- LT1034BCZ-1.2#PBF LT1034BCZ-1.2#TRPBF LT1034BCZ-2.5#PBF LT1034BCZ-2.5#TRPBF LT1034BIZ-1.2#PBF LT1034BIZ-1.2#TRPBF LT1034BIZ-2.5#PBF LT1034BIZ-2.5#TRPBF LT1034CS8-1.2#PBF LT1034CS8-1.2#TRPBF LT1034CS8-2.5#PBF LT1034CS8-2.5#TRPBF LT1034CZ-1.2#PBF LT1034CZ-1.2#TRPBF LT1034CZ-2.5#PBF LT1034CZ-2.5#TRPBF LT1034IS8-1.2#PBF LT1034IS8-1.2#TRPBF LT1034IS8-2.5#PBF LT1034IS8-2.5#TRPBF LT1034IZ-1.2#PBF LT1034IZ-1.2#TRPBF LT1034IZ-2.5#PBF LT1034IZ-2.5#TRPBF
文件文字版本
LT1034-1.2/LT1034-2.5
U PACKAGE DESCRIPTIO H Package 8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320) 0.209 – 0.219 (5.309 – 5.537) 0.178 – 0.195 0.100 0.085 – 0.105 0.050 (4.521 – 4.953) (2.540) (2.159 – 2.667) 0.050 (1.270) TYP (1.270) 0.500 TYP TYP (12.700) PIN 1 MIN REFERENCE FOR 3-LEAD PACKAGE ONLY PLANE * 0.025 45° (0.635) 0.036 – 0.046 0.028 – 0.048 MAX (0.914 – 1.168) (0.711 – 1.219) 0.016 – 0.021** (0.406 – 0.533) H02/03(TO-46) 1098 DIA *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610)
OBSOLETE PACKAGE S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) 0.189 – 0.197* (4.801 – 5.004) 8 7 6 5 0.228 – 0.244 0.150 – 0.157** (5.791 – 6.197) (3.810 – 3.988) SO8 1298 1 2 3 4 0.010 – 0.020 × 45° 0.053 – 0.069 (0.254 – 0.508) (1.346 – 1.752) 0.004 – 0.010 0.008 – 0.010 0 (0.101 – 0.254) (0.203 – 0.254) °– 8° TYP 0.016 – 0.050 0.014 – 0.019 0.050 (0.406 – 1.270) (0.355 – 0.483) (1.270) TYP BSC *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE 1034fe 6
U PACKAGE DESCRIPTIO H Package 8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320) 0.209 – 0.219 (5.309 – 5.537) 0.178 – 0.195 0.100 0.085 – 0.105 0.050 (4.521 – 4.953) (2.540) (2.159 – 2.667) 0.050 (1.270) TYP (1.270) 0.500 TYP TYP (12.700) PIN 1 MIN REFERENCE FOR 3-LEAD PACKAGE ONLY PLANE * 0.025 45° (0.635) 0.036 – 0.046 0.028 – 0.048 MAX (0.914 – 1.168) (0.711 – 1.219) 0.016 – 0.021** (0.406 – 0.533) H02/03(TO-46) 1098 DIA *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610)
OBSOLETE PACKAGE S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610) 0.189 – 0.197* (4.801 – 5.004) 8 7 6 5 0.228 – 0.244 0.150 – 0.157** (5.791 – 6.197) (3.810 – 3.988) SO8 1298 1 2 3 4 0.010 – 0.020 × 45° 0.053 – 0.069 (0.254 – 0.508) (1.346 – 1.752) 0.004 – 0.010 0.008 – 0.010 0 (0.101 – 0.254) (0.203 – 0.254) °– 8° TYP 0.016 – 0.050 0.014 – 0.019 0.050 (0.406 – 1.270) (0.355 – 0.483) (1.270) TYP BSC *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE 1034fe 6