LTC3890 PIN FUNCTIONSSENSE1–, SENSE2– (Pin 1, Pin 9): The (–) Input to the SGND (Pins 6, Exposed Pad Pin 33): Small-signal ground Differential Current Comparators. When greater than common to both controllers, must be routed separately INTVCC – 0.5V, the SENSE– pin supplies current to the from high current grounds to the common (–) terminals current comparator. of the CIN capacitors. The exposed pad must be soldered FREQ (Pin 2): The frequency control pin for the internal to PCB ground for rated thermal performance. VCO. Connecting the pin to GND forces the VCO to a fixed RUN1, RUN2 (Pin 7, Pin 8): Digital Run Control Inputs low frequency of 350kHz. Connecting the pin to INTVCC for Each Controller. Forcing RUN1 below 1.16V or RUN2 forces the VCO to a fixed high frequency of 535kHz. below 1.20V shuts down that controller. Forcing both of Other frequencies between 50kHz and 900kHz can be these pins below 0.7V shuts down the entire LTC3890, programmed using a resistor between FREQ and GND. reducing quiescent current to approximately 14µA. An internal 20µA pull-up current develops the voltage to INTV be used by the VCO to control the frequency. CC (Pin 19): Output of the Internal Linear Low Dropout Regulator. The driver and control circuits are powered from PHASMD (Pin 3): Control Input to Phase Selector which this voltage source. Must be decoupled to power ground determines the phase relationships between control- with a minimum of 4.7µF ceramic or other low ESR ca- ler 1, controller 2 and the CLKOUT signal. Pulling this pacitor. Do not use the INTVCC pin for any other purpose. pin to ground forces TG2 and CLKOUT to be out of phase EXTV 180° and 60° with respect to TG1. Connecting this pin to CC (Pin 20): External Power Input to an Internal LDO Connected to INTV INTV CC. This LDO supplies INTVCC power, CC forces TG2 and CLKOUT to be out of phase 240° bypassing the internal LDO powered from V and 120° with respect to TG1. Floating this pin forces TG2 IN whenever EXTV and CLKOUT to be out of phase 180° and 90° with respect CC is higher than 4.7V. See EXTVCC Connection in the Applications Information section. Do not float or exceed to TG1. Refer to Table 1. 14V on this pin. CLKOUT (Pin 4): Output clock signal available to daisy- PGND (Pin 21): Driver Power Ground. Connects to the chain other controller ICs for additional MOSFET driver sources of bottom (synchronous) N-channel MOSFETs stages/phases. The output levels swing from INTVCC to and the (–) terminal(s) of C ground. IN. VPLLIN/MODE (Pin 5): External Synchronization Input to IN (Pin 22): Main Supply Pin. A bypass capacitor should be tied between this pin and the signal ground pin. Phase Detector and Forced Continuous Mode Input. When an external clock is applied to this pin, the phase-locked BG1, BG2 (Pin 23, Pin 18): High Current Gate Drives loop will force the rising TG1 signal to be synchronized for Bottom (Synchronous) N-Channel MOSFETs. Voltage with the rising edge of the external clock. When not syn- swing at these pins is from ground to INTVCC. chronizing to an external clock, this input, which acts on BOOST1, BOOST2 (Pin 24, Pin 17): Bootstrapped Supplies both controllers, determines how the LTC3890 operates at to the Topside Floating Drivers. Capacitors are connected light loads. Pulling this pin to ground selects Burst Mode between the BOOST and SW pins and Schottky diodes are operation. An internal 100k resistor to ground also invokes tied between the BOOST and INTV Burst Mode operation when the pin is floated. Tying this pin CC pins. Voltage swing at the BOOST pins is from INTV to INTV CC to (VIN + INTVCC). CC forces continuous inductor current operation. Tying this pin to a voltage greater than 1.2V and less than SW1, SW2 (Pin 25, Pin 16): Switch Node Connections INTV to Inductors. CC – 1.3V selects pulse-skipping operation. 3890fc 8 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts