Datasheet LTC3632 (Analog Devices) - 20
| 制造商 | Analog Devices |
| 描述 | High Efficiency, High Voltage 20mA Synchronous Step-Down Converter |
| 页数 / 页 | 22 / 20 — PACKAGE DESCRIPTION. MS8E Package. 8-Lead Plastic MSOP, Exposed Die Pad. … |
| 文件格式/大小 | PDF / 1.7 Mb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. MS8E Package. 8-Lead Plastic MSOP, Exposed Die Pad. NO MEASUREMENT PURPOSE
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LTC3632
PACKAGE DESCRIPTION MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev I) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 1 (.074) 0.29 1.88 ± 0.102 1.68 REF (.074 ± .004) 0.889 ± 0.127 (.035 ± .005) (.066) 0.05 REF 5.23 DETAIL “B” (.206) 1.68 ± 0.102 3.20 – 3.45 CORNER TAIL IS PART OF MIN (.066 ± .004) (.126 – .136) DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 8
NO MEASUREMENT PURPOSE
3.00 ± 0.102 0.65 0.42 (.118 ± 0.038 ± .004) 0.52 (.0256) (.0165 ± .0015) (NOTE 3) BSC 8 7 6 5 (.0205) TYP REF RECOMMENDED SOLDER PAD LAYOUT 4.90 ± 0.152 3.00 ± 0.102 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 ± 0.0508 (.009 – .015) (.004 ± .002) TYP 0.65 MSOP (MS8E) 0910 REV I NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 3632fc 20 Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS BLOCK DIAGRAM OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATIONS PACKAGE DESCRIPTION REVISION HISTORY TYPICAL APPLICATION RELATED PARTS
PACKAGE DESCRIPTION MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev I) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 1 (.074) 0.29 1.88 ± 0.102 1.68 REF (.074 ± .004) 0.889 ± 0.127 (.035 ± .005) (.066) 0.05 REF 5.23 DETAIL “B” (.206) 1.68 ± 0.102 3.20 – 3.45 CORNER TAIL IS PART OF MIN (.066 ± .004) (.126 – .136) DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 8
NO MEASUREMENT PURPOSE
3.00 ± 0.102 0.65 0.42 (.118 ± 0.038 ± .004) 0.52 (.0256) (.0165 ± .0015) (NOTE 3) BSC 8 7 6 5 (.0205) TYP REF RECOMMENDED SOLDER PAD LAYOUT 4.90 ± 0.152 3.00 ± 0.102 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 ± 0.0508 (.009 – .015) (.004 ± .002) TYP 0.65 MSOP (MS8E) 0910 REV I NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 3632fc 20 Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS BLOCK DIAGRAM OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATIONS PACKAGE DESCRIPTION REVISION HISTORY TYPICAL APPLICATION RELATED PARTS