Datasheet AD8233 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | 50 μA, 2 mm × 1.7 mm WLCSP, Low Noise, Heart Rate Monitor for Wearable Products |
| 页数 / 页 | 29 / 6 — AD8233. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. … |
| 修订版 | C |
| 文件格式/大小 | PDF / 613 Kb |
| 文件语言 | 英语 |
AD8233. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter Rating. Table 4. Thermal Resistance. Package
文件文字版本
AD8233 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage 3.6 V (PCB) design and operating environment. Careful attention to Output Short-Circuit Current Duration Indefinite PCB thermal design is required. Maximum Voltage, Any Terminal1 +VS + 0.3 V
Table 4. Thermal Resistance
Minimum Voltage, Any Terminal1 −0.3 V
θ
Storage Temperature Range −65°C to +125°C
Package JA (°C/W) θJC Type PCB Power (W) 0 ms 1 ms 2 ms (°C/W)
Operating Temperature Range −40°C to +85°C CP-20-13 1S0P1 0.25 108.5 89.0 82.3 0.6 Maximum Junction Temperature 140°C 1.25 101.1 87.3 87.3 0.6 ESD Rating 2S2P2 0.25 47.9 43.4 42.1 0.7 HBM 8 kV 1.25 46.8 43.3 42.1 0.7 Charged Device Model (FICDM) 1 kV 1 1 This level or the maximum specified supply voltage, whichever is the lesser, Simulated thermal numbers per JESD51-9: 1-layer PCB (1S0P), low effective indicates the superior voltage limit for any terminal. If input voltages beyond thermal conductivity test board. 2 the specified minimum or maximum voltages are expected, place resistors in 4-layer PCB (2S2P), high effective thermal conductivity test board. series with the inputs to limit the current to less than 5 mA. Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 29 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS INSTRUMENTATION AMPLIFIER PERFORMANCE CHARACTERISTICS OPERATIONAL AMPLIFIER PERFORMANCE CHARACTERISTICS RIGHT LEG DRIVE (RLD) AMPLIFIER PERFORMANCE CHARACTERISTICS REFERENCE BUFFER PERFORMANCE CHARACTERISTICS SYSTEM PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ARCHITECTURE OVERVIEW INSTRUMENTATION AMPLIFIER OPERATIONAL AMPLIFIER RIGHT LEG DRIVE AMPLIFIER REFERENCE BUFFER FAST RESTORE CIRCUIT LEADS ON/OFF DETECTION DC Leads On/Off Detection AC Leads On/Off Detection STANDBY OPERATION INPUT PROTECTION RADIO FREQUENCY INTERFERENCE (RFI) POWER SUPPLY REGULATION AND BYPASSING INPUT REFERRED OFFSETS LAYOUT RECOMMENDATIONS APPLICATIONS INFORMATION ELIMINATING ELECTRODE OFFSETS HIGH-PASS FILTERING Two-Pole High-Pass Filter Additional High-Pass Filtering Options LOW-PASS FILTERING AND GAIN Driving ADCs DRIVEN ELECTRODE APPLICATION CIRCUITS HEART RATE MEASUREMENT (HRM) NEXT TO THE HEART EXERCISE APPLICATION—HEART RATE MEASURED AT THE HANDS HOLTER MONITOR CONFIGURATION SYNCHRONIZED ECG AND PPG MEASUREMENT PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board Supply Voltage 3.6 V (PCB) design and operating environment. Careful attention to Output Short-Circuit Current Duration Indefinite PCB thermal design is required. Maximum Voltage, Any Terminal1 +VS + 0.3 V
Table 4. Thermal Resistance
Minimum Voltage, Any Terminal1 −0.3 V
θ
Storage Temperature Range −65°C to +125°C
Package JA (°C/W) θJC Type PCB Power (W) 0 ms 1 ms 2 ms (°C/W)
Operating Temperature Range −40°C to +85°C CP-20-13 1S0P1 0.25 108.5 89.0 82.3 0.6 Maximum Junction Temperature 140°C 1.25 101.1 87.3 87.3 0.6 ESD Rating 2S2P2 0.25 47.9 43.4 42.1 0.7 HBM 8 kV 1.25 46.8 43.3 42.1 0.7 Charged Device Model (FICDM) 1 kV 1 1 This level or the maximum specified supply voltage, whichever is the lesser, Simulated thermal numbers per JESD51-9: 1-layer PCB (1S0P), low effective indicates the superior voltage limit for any terminal. If input voltages beyond thermal conductivity test board. 2 the specified minimum or maximum voltages are expected, place resistors in 4-layer PCB (2S2P), high effective thermal conductivity test board. series with the inputs to limit the current to less than 5 mA. Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 29 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS INSTRUMENTATION AMPLIFIER PERFORMANCE CHARACTERISTICS OPERATIONAL AMPLIFIER PERFORMANCE CHARACTERISTICS RIGHT LEG DRIVE (RLD) AMPLIFIER PERFORMANCE CHARACTERISTICS REFERENCE BUFFER PERFORMANCE CHARACTERISTICS SYSTEM PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ARCHITECTURE OVERVIEW INSTRUMENTATION AMPLIFIER OPERATIONAL AMPLIFIER RIGHT LEG DRIVE AMPLIFIER REFERENCE BUFFER FAST RESTORE CIRCUIT LEADS ON/OFF DETECTION DC Leads On/Off Detection AC Leads On/Off Detection STANDBY OPERATION INPUT PROTECTION RADIO FREQUENCY INTERFERENCE (RFI) POWER SUPPLY REGULATION AND BYPASSING INPUT REFERRED OFFSETS LAYOUT RECOMMENDATIONS APPLICATIONS INFORMATION ELIMINATING ELECTRODE OFFSETS HIGH-PASS FILTERING Two-Pole High-Pass Filter Additional High-Pass Filtering Options LOW-PASS FILTERING AND GAIN Driving ADCs DRIVEN ELECTRODE APPLICATION CIRCUITS HEART RATE MEASUREMENT (HRM) NEXT TO THE HEART EXERCISE APPLICATION—HEART RATE MEASURED AT THE HANDS HOLTER MONITOR CONFIGURATION SYNCHRONIZED ECG AND PPG MEASUREMENT PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE