Datasheet LT3514 (Analog Devices) - 23
| 制造商 | Analog Devices |
| 描述 | Triple Step-Down Switching Regulator with 100% Duty Cycle Operation |
| 页数 / 页 | 26 / 23 — PACKAGE DESCRIPTION. Please refer to … |
| 文件格式/大小 | PDF / 482 Kb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings
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LT3514
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. FE Package 24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1771 Rev B)
Exposed Pad Variation AA
7.70 – 7.90* 3.25 (.303 – .311) (.128) 3.25 (.128) 24 23 22 21 20 19 18 17 16 15 14 13 6.60 ±0.10 2.74 (.108) 4.50 ±0.10 6.40 2.74 SEE NOTE 4 (.252) (.108) 0.45 ±0.05 BSC 1.05 ±0.10 0.65 BSC RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 11 12 1.20 4.30 – 4.50* (.047) 0.25 (.169 – .177) MAX REF 0° – 8° 0.65 0.09 – 0.20 0.50 – 0.75 (.0256) 0.05 – 0.15 (.0035 – .0079) (.020 – .030) BSC (.002 – .006) 0.195 – 0.30 FE24 (AA) TSSOP REV B 0910 (.0077 – .0118) TYP NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE MILLIMETERS FOR EXPOSED PAD ATTACHMENT 2. DIMENSIONS ARE IN (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 3. DRAWING NOT TO SCALE 3514fa For more information www.linear.com/LT3514 23 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. FE Package 24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1771 Rev B)
Exposed Pad Variation AA
7.70 – 7.90* 3.25 (.303 – .311) (.128) 3.25 (.128) 24 23 22 21 20 19 18 17 16 15 14 13 6.60 ±0.10 2.74 (.108) 4.50 ±0.10 6.40 2.74 SEE NOTE 4 (.252) (.108) 0.45 ±0.05 BSC 1.05 ±0.10 0.65 BSC RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 11 12 1.20 4.30 – 4.50* (.047) 0.25 (.169 – .177) MAX REF 0° – 8° 0.65 0.09 – 0.20 0.50 – 0.75 (.0256) 0.05 – 0.15 (.0035 – .0079) (.020 – .030) BSC (.002 – .006) 0.195 – 0.30 FE24 (AA) TSSOP REV B 0910 (.0077 – .0118) TYP NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE MILLIMETERS FOR EXPOSED PAD ATTACHMENT 2. DIMENSIONS ARE IN (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 3. DRAWING NOT TO SCALE 3514fa For more information www.linear.com/LT3514 23 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts