Datasheet LTC3600 (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | 15V, 1.5A Synchronous Rail-to-Rail Single Resistor Step-Down Regulator |
| 页数 / 页 | 28 / 4 — elecTrical characTerisTics Note 1:. Note 3:. Note 4:. Note 5:. Note 2:. … |
| 文件格式/大小 | PDF / 852 Kb |
| 文件语言 | 英语 |
elecTrical characTerisTics Note 1:. Note 3:. Note 4:. Note 5:. Note 2:. Note 6:
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文件文字版本
LTC3600
elecTrical characTerisTics Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
Dynamic supply current is higher due to the internal gate charge may cause permanent damage to the device. Exposure to any Absolute being delivered at the switching frequency. Maximum Rating condition for extended periods may affect device
Note 4:
The LTC3600 is tested in a feedback loop that adjusts VOUT to reliability and lifetime. Absolute Maximum Ratings are those values achieve a specified error amplifier output voltage (ITH). beyond which the life of a device may be impaired.
Note 5:
This IC includes overtemperature protection that is intended
Note 2:
The LTC3600 is tested under pulsed load conditions such that protect the device during momentary overload conditions. Junction TJ ≈ TA. The LTC3600E is guaranteed to meet performance specifications temperature will exceed 125°C when overtemperature protection is active. from 0°C to 85°C junction temperature. Specifications over the Continuous operation above the specified maximum operating junction –40°C to 125°C operating junction temperature range are assured by temperature may impair device reliability. design, characterization and correlation with statistical process controls.
Note 6:
Duration of voltage transient is less than 20ns for each switching The LTC3600I is guaranteed over the full –40°C to 125°C operating cycle. junction temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal impedance and other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in watts) according to the formula: TJ = TA + (PD • θJA), where θJA (in °C/W) is the package thermal impedance. 3600fd 4 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
elecTrical characTerisTics Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
Dynamic supply current is higher due to the internal gate charge may cause permanent damage to the device. Exposure to any Absolute being delivered at the switching frequency. Maximum Rating condition for extended periods may affect device
Note 4:
The LTC3600 is tested in a feedback loop that adjusts VOUT to reliability and lifetime. Absolute Maximum Ratings are those values achieve a specified error amplifier output voltage (ITH). beyond which the life of a device may be impaired.
Note 5:
This IC includes overtemperature protection that is intended
Note 2:
The LTC3600 is tested under pulsed load conditions such that protect the device during momentary overload conditions. Junction TJ ≈ TA. The LTC3600E is guaranteed to meet performance specifications temperature will exceed 125°C when overtemperature protection is active. from 0°C to 85°C junction temperature. Specifications over the Continuous operation above the specified maximum operating junction –40°C to 125°C operating junction temperature range are assured by temperature may impair device reliability. design, characterization and correlation with statistical process controls.
Note 6:
Duration of voltage transient is less than 20ns for each switching The LTC3600I is guaranteed over the full –40°C to 125°C operating cycle. junction temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal impedance and other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in watts) according to the formula: TJ = TA + (PD • θJA), where θJA (in °C/W) is the package thermal impedance. 3600fd 4 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts