Datasheet LTC3672B-1 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | Monolithic Fixed-Output 400mA Buck Regulator with Dual 150mA LDOs in 2mm x 2mm DFN |
| 页数 / 页 | 12 / 10 — APPLICATIONS INFORMATION. PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS |
| 文件格式/大小 | PDF / 176 Kb |
| 文件语言 | 英语 |
APPLICATIONS INFORMATION. PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
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LTC3672B-1
APPLICATIONS INFORMATION PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
connect directly to the ground plane of the part. The VIN capacitor provides the AC current to the buck regulator’s When laying out the printed circuit board, the following power MOSFETs and their drivers. It is especially important list should be followed to ensure proper operation of the to minimize PCB trace inductance from this capacitor to LTC3672B-1: the VIN and GND pins of the LTC3672B-1. 1) The Exposed Pad of the package should connect directly 3) The switching power trace connecting the SW pin to to a large ground plane to minimize thermal and electrical the inductor should be kept as short as possible to reduce impedance. radiated EMI and parasitic coupling. 2) The connections from the input supply pins (VIN and VIN1) 4) The LDO output capacitors should be placed as close to their respective decoupling capacitors should be kept as to the IC as possible, and connect to the LDO outputs and short as possible. The GND side of these capacitors should the GND pin as directly as possible. 3672B1f 10
APPLICATIONS INFORMATION PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
connect directly to the ground plane of the part. The VIN capacitor provides the AC current to the buck regulator’s When laying out the printed circuit board, the following power MOSFETs and their drivers. It is especially important list should be followed to ensure proper operation of the to minimize PCB trace inductance from this capacitor to LTC3672B-1: the VIN and GND pins of the LTC3672B-1. 1) The Exposed Pad of the package should connect directly 3) The switching power trace connecting the SW pin to to a large ground plane to minimize thermal and electrical the inductor should be kept as short as possible to reduce impedance. radiated EMI and parasitic coupling. 2) The connections from the input supply pins (VIN and VIN1) 4) The LDO output capacitors should be placed as close to their respective decoupling capacitors should be kept as to the IC as possible, and connect to the LDO outputs and short as possible. The GND side of these capacitors should the GND pin as directly as possible. 3672B1f 10