Datasheet LTM4623 (Analog Devices) - 4

制造商Analog Devices
描述Ultrathin 20VIN, 3A Step-Down DC/DC µModule Regulator
页数 / 页28 / 4 — The. denotes the specifications which apply over the full internal
修订版D
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The. denotes the specifications which apply over the full internal

The denotes the specifications which apply over the full internal

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LTM4623 ELECTRICAL CHARACTERISTICS
The
l
denotes the specifications which apply over the full internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = SVIN = 12V per the typical application shown on the front page. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
IPGOOD PGOOD Leakage 2 µA VPGL PGOOD Voltage Low IPGOOD = 1mA 0.02 0.1 V VINTVCC Internal VCC Voltage SVIN = 4V to 20V 3.1 3.3 3.4 V VINTVCC Load Reg INTVCC Load Regulation ICC = 0mA to 20mA 0.5 % fOSC Oscillator Frequency FREQ = OPEN 1 MHz
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
See output current derating curves for different VIN, VOUT and TA. may cause permanent damage to the device. Exposure to any Absolute
Note 4:
100% tested at wafer level. Maximum Rating condition for extended periods may affect device
Note 5:
This IC includes overtemperature protection that is intended reliability and lifetime. to protect the device during momentary overload conditions. Junction
Note 2:
The LTM4623 is tested under pulsed load conditions such that temperature will exceed 125°C when overtemperature protection is active. TJ ≈ TA. The LTM4623E is guaranteed to meet performance specifications Continuous operation above the specified maximum operating junction over the 0°C to 125°C internal operating temperature range. Specifications temperature may impair device reliability. over the –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM4623I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. Rev D 4 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photos Design Resources Related Parts