Datasheet LT8390A (Analog Devices) - 9
| 制造商 | Analog Devices |
| 描述 | 60V 2MHz Synchronous 4-Switch Buck-Boost Controller with Spread Spectrum |
| 页数 / 页 | 30 / 9 — TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted. … |
| 文件格式/大小 | PDF / 1.1 Mb |
| 文件语言 | 英语 |
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted. Oscillator Frequency. ISMON Voltage vs V(ISP-ISN)
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LT8390A
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted. Oscillator Frequency ISMON Voltage vs V(ISP-ISN) SS Current vs Temperature vs Temperature
1.50 15.0 2.5 R 1.25 12.5 T = 59.0k PULL-UP 2.0 1.00 10.0 1.5 RT = 100k (V) 0.75 (µA) 7.5 I SS V ISMON 1.0 0.50 5.0 RT = 226k 0.25 2.5 0.5 PULL-DOWN SWITCHING FREQUENCY (MHz) 0 0.0 0 0 20 40 60 80 100 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 V(ISP-ISN) (mV) TEMPERATURE (°C) TEMPERATURE (°C) 8390a G28 8390a G30 8390a G29
PIN FUNCTIONS BG1:
Buck Side Bottom Gate Drive. Drives the gate of buck
INTVCC:
Internal 5V Linear Regulator Output. The INTVCC side bottom N-channel MOSFET with a voltage swing from linear regulator is supplied from the VIN pin, and powers the ground to INTVCC. internal control circuitry and gate drivers. Locally bypass
BST1:
Buck Side Bootstrap Floating Driver Supply. The this pin to ground with a minimum 4.7µF ceramic capacitor. BST1 pin has an integrated bootstrap Schottky diode from
EN/UVLO:
Enable and Undervoltage Lockout. Force the the INTVCC pin and requires an external bootstrap capacitor pin below 0.3V to shut down the part and reduce VIN qui- to the SW1 pin. The BST1 pin swings from a diode voltage escent current below 2µA. Force the pin above 1.233V for drop below INTVCC to (VIN + INTVCC). normal operation. The accurate 1.220V falling threshold
SW1:
Buck Side Switch Node. The SW1 pin swings from can be used to program an undervoltage lockout (UVLO) a Schottky diode voltage drop below ground up to V threshold with a resistor divider from VIN to ground. An IN. accurate 2.5µA pull-down current allows the programming
TG1:
Buck Side Top Gate Drive. Drives the gate of buck of VIN UVLO hysteresis. If neither function is used, tie this side top N-channel MOSFET with a voltage swing from pin directly to VIN. SW1 to BST1.
TEST:
Factory Test. This pin is used for testing purpose
LSP:
Positive Terminal of the Buck Side Inductor Current only and must be directly connected to ground for the Sense Resistor (RSENSE). Ensure accurate current sense part to operate properly. with Kelvin connection.
LOADEN:
Load Switch Enable Input. The LOADEN pin is
LSN:
Negative Terminal of the Buck Side Inductor Current used to control the ON/OFF of the high side PMOS load Sense Resistor (RSENSE). Ensure accurate current sense switch. If the load switch control is not used, tie this pin with Kelvin connection. to VREF or INTVCC. Forcing the pin low turns off TG1 and
V
TG2, turns on BG1 and BG2, disconnects the V
IN:
Input Supply. The VIN pin must be tied to the power C pin from input to determine the buck, buck-boost, or boost operation all internal loads, and turns off LOADTG. regions. Locally bypass this pin to ground with a minimum
VREF:
Voltage Reference Output. The VREF pin provides 1µF ceramic capacitor. an accurate 2V reference capable of supplying 1mA current. Local y bypass this pin to ground with a 0.47µF ceramic capacitor. 8390afa For more information www.linear.com/LT8390A 9 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted. Oscillator Frequency ISMON Voltage vs V(ISP-ISN) SS Current vs Temperature vs Temperature
1.50 15.0 2.5 R 1.25 12.5 T = 59.0k PULL-UP 2.0 1.00 10.0 1.5 RT = 100k (V) 0.75 (µA) 7.5 I SS V ISMON 1.0 0.50 5.0 RT = 226k 0.25 2.5 0.5 PULL-DOWN SWITCHING FREQUENCY (MHz) 0 0.0 0 0 20 40 60 80 100 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 V(ISP-ISN) (mV) TEMPERATURE (°C) TEMPERATURE (°C) 8390a G28 8390a G30 8390a G29
PIN FUNCTIONS BG1:
Buck Side Bottom Gate Drive. Drives the gate of buck
INTVCC:
Internal 5V Linear Regulator Output. The INTVCC side bottom N-channel MOSFET with a voltage swing from linear regulator is supplied from the VIN pin, and powers the ground to INTVCC. internal control circuitry and gate drivers. Locally bypass
BST1:
Buck Side Bootstrap Floating Driver Supply. The this pin to ground with a minimum 4.7µF ceramic capacitor. BST1 pin has an integrated bootstrap Schottky diode from
EN/UVLO:
Enable and Undervoltage Lockout. Force the the INTVCC pin and requires an external bootstrap capacitor pin below 0.3V to shut down the part and reduce VIN qui- to the SW1 pin. The BST1 pin swings from a diode voltage escent current below 2µA. Force the pin above 1.233V for drop below INTVCC to (VIN + INTVCC). normal operation. The accurate 1.220V falling threshold
SW1:
Buck Side Switch Node. The SW1 pin swings from can be used to program an undervoltage lockout (UVLO) a Schottky diode voltage drop below ground up to V threshold with a resistor divider from VIN to ground. An IN. accurate 2.5µA pull-down current allows the programming
TG1:
Buck Side Top Gate Drive. Drives the gate of buck of VIN UVLO hysteresis. If neither function is used, tie this side top N-channel MOSFET with a voltage swing from pin directly to VIN. SW1 to BST1.
TEST:
Factory Test. This pin is used for testing purpose
LSP:
Positive Terminal of the Buck Side Inductor Current only and must be directly connected to ground for the Sense Resistor (RSENSE). Ensure accurate current sense part to operate properly. with Kelvin connection.
LOADEN:
Load Switch Enable Input. The LOADEN pin is
LSN:
Negative Terminal of the Buck Side Inductor Current used to control the ON/OFF of the high side PMOS load Sense Resistor (RSENSE). Ensure accurate current sense switch. If the load switch control is not used, tie this pin with Kelvin connection. to VREF or INTVCC. Forcing the pin low turns off TG1 and
V
TG2, turns on BG1 and BG2, disconnects the V
IN:
Input Supply. The VIN pin must be tied to the power C pin from input to determine the buck, buck-boost, or boost operation all internal loads, and turns off LOADTG. regions. Locally bypass this pin to ground with a minimum
VREF:
Voltage Reference Output. The VREF pin provides 1µF ceramic capacitor. an accurate 2V reference capable of supplying 1mA current. Local y bypass this pin to ground with a 0.47µF ceramic capacitor. 8390afa For more information www.linear.com/LT8390A 9 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts