Datasheet MBRS120T3G, SBRS8120T3G (ON Semiconductor)
| 制造商 | ON Semiconductor |
| 描述 | Surface Mount Schottky Power Rectifier |
| 页数 / 页 | 4 / 1 — Preferred Device. www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 1.0 … |
| 修订版 | 8 |
| 文件格式/大小 | PDF / 132 Kb |
| 文件语言 | 英语 |
Preferred Device. www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 1.0 AMPERE, 20 VOLTS. Features. SMB. CASE 403A. MARKING DIAGRAM
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MBRS120T3G, SBRS8120T3G
Preferred Device
Surface Mount Schottky Power Rectifier This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features
www.onsemi.com
epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or
SCHOTTKY BARRIER
as free wheeling and polarity protection diodes in surface mount
RECTIFIER
applications where compact size and weight are critical to the system.
1.0 AMPERE, 20 VOLTS Features
• Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop (0.55 Volts Max @ 1.0 A, TJ = 25°C) • Excellent Ability to Withstand Reverse Avalanche Energy Transients
SMB
•
CASE 403A
Guard−Ring for Stress Protection • ESD Ratings:
MARKING DIAGRAM
♦ Human Body Model = 3B (> 16000 V) ♦ Machine Model = C (> 400 V) • SBRS8 Prefix for Automotive and Other Applications Requiring AYWW Unique Site and Control Change Requirements; AEC−Q101 B12G Qualified and PPAP Capable* G • These are Pb−Free Devices
Mechanical Characteristics
B12 = Specific Device Code • Case: Epoxy, Molded A = Assembly Location** • Y = Year Weight: 95 mg (Approximately) WW = Work Week • Finish: All External Surfaces Corrosion Resistant and Terminal G = Pb−Free Package Leads are Readily Solderable (Note: Microdot may be in either location) • Lead and Mounting Surface Temperature for Soldering Purposes: **The Assembly Location code (A) is front side 260°C Max. for 10 Seconds optional. In cases where the Assembly Location is • stamped in the package bottom (molding ejecter pin), Cathode Polarity Band the front side assembly code may be blank.
ORDERING INFORMATION Device Package Shipping
† MBRS120T3G SMB 2,500 / (Pb−Free) Tape & Reel SBRS8120T3G* SMB 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
June, 2017 − Rev. 8 MBRS120T3/D
Preferred Device
Surface Mount Schottky Power Rectifier This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features
www.onsemi.com
epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or
SCHOTTKY BARRIER
as free wheeling and polarity protection diodes in surface mount
RECTIFIER
applications where compact size and weight are critical to the system.
1.0 AMPERE, 20 VOLTS Features
• Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop (0.55 Volts Max @ 1.0 A, TJ = 25°C) • Excellent Ability to Withstand Reverse Avalanche Energy Transients
SMB
•
CASE 403A
Guard−Ring for Stress Protection • ESD Ratings:
MARKING DIAGRAM
♦ Human Body Model = 3B (> 16000 V) ♦ Machine Model = C (> 400 V) • SBRS8 Prefix for Automotive and Other Applications Requiring AYWW Unique Site and Control Change Requirements; AEC−Q101 B12G Qualified and PPAP Capable* G • These are Pb−Free Devices
Mechanical Characteristics
B12 = Specific Device Code • Case: Epoxy, Molded A = Assembly Location** • Y = Year Weight: 95 mg (Approximately) WW = Work Week • Finish: All External Surfaces Corrosion Resistant and Terminal G = Pb−Free Package Leads are Readily Solderable (Note: Microdot may be in either location) • Lead and Mounting Surface Temperature for Soldering Purposes: **The Assembly Location code (A) is front side 260°C Max. for 10 Seconds optional. In cases where the Assembly Location is • stamped in the package bottom (molding ejecter pin), Cathode Polarity Band the front side assembly code may be blank.
ORDERING INFORMATION Device Package Shipping
† MBRS120T3G SMB 2,500 / (Pb−Free) Tape & Reel SBRS8120T3G* SMB 2,500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
June, 2017 − Rev. 8 MBRS120T3/D