Datasheet LTM8003 (Analog Devices) - 2
| 制造商 | Analog Devices |
| 描述 | 40VIN, 3.5A Step-Down Silent Switcher μModule Regulator |
| 页数 / 页 | 30 / 2 — ABSOLUTE MAXIMUM RATINGS (Notes 1, 2). PIN CONFIGURATION. ORDER … |
| 修订版 | E |
| 文件格式/大小 | PDF / 2.6 Mb |
| 文件语言 | 英语 |
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2). PIN CONFIGURATION. ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. PART NUMBER
该数据表的模型线
文件文字版本
LTM8003
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2)
V Maximum Internal Temperature (I-Grade) ... 125°C IN, RUN, PG Voltage .. 42V V Maximum Internal Temperature (H-Grade) ... 150°C OUT, BIAS Voltage ... 19V FB, TR/SS Voltage ... 4V Storage Temperature (I-Grade) ... 125°C SYNC Voltage .. 6V Storage Temperature (H-Grade) ... –50°C to 150°C Peak Reflow Solder Body Temperature ... 250°C
PIN CONFIGURATION
TOP VIEW TOP VIEW ADJUSTABLE VERSION FIXED OUTPUT VERSION SYNC TR/SS GND SYNC TR/SS GND A RT A RT GND RUN GND RUN B B PG PG C C BANK2 BANK2 VIN VIN D D BANK 1 GND BANK 1 GND E NC E NC FB F F BIAS BIAS G G BANK 3 VOUT BANK 3 VOUT H H 1 2 3 4 5 6 1 2 3 4 5 6 BGA PACKAGE BGA PACKAGE 48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE 48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE TJMAX = 150°C, θJA = 24.7°C/W, θJCbottom = 4.5°C/W TJMAX = 150°C, θJA = 24.7°C/W, θJCbottom = 4.5°C/W θJCtop = 22.3°C/W, θJB = 4.2°C/W, WEIGHT = 0.5g θJCtop = 22.3°C/W, θJB = 4.2°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC51-9, 51-12 θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8003IY#PBF SAC305 (RoHS) LTM8003 e1 BGA 3 –40°C to 125°C LTM8003HY#PBF SAC305 (RoHS) LTM8003 e1 BGA 3 –40°C to 150°C LTM8003IY SnPb (63/37) LTM8003 e0 BGA 3 –40°C to 125°C LTM8003HY SnPb (63/37) LTM8003 e0 BGA 3 –40°C to 150°C LTM8003IY-3.3#PBF SAC305 (RoHS) LTM8003-3.3 e1 BGA 3 –40°C to 125°C LTM8003HY-3.3#PBF SAC305 (RoHS) LTM8003-3.3 e1 BGA 3 –40°C to 150°C • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev E 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Photo Package Description Revision History Typical Application Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2)
V Maximum Internal Temperature (I-Grade) ... 125°C IN, RUN, PG Voltage .. 42V V Maximum Internal Temperature (H-Grade) ... 150°C OUT, BIAS Voltage ... 19V FB, TR/SS Voltage ... 4V Storage Temperature (I-Grade) ... 125°C SYNC Voltage .. 6V Storage Temperature (H-Grade) ... –50°C to 150°C Peak Reflow Solder Body Temperature ... 250°C
PIN CONFIGURATION
TOP VIEW TOP VIEW ADJUSTABLE VERSION FIXED OUTPUT VERSION SYNC TR/SS GND SYNC TR/SS GND A RT A RT GND RUN GND RUN B B PG PG C C BANK2 BANK2 VIN VIN D D BANK 1 GND BANK 1 GND E NC E NC FB F F BIAS BIAS G G BANK 3 VOUT BANK 3 VOUT H H 1 2 3 4 5 6 1 2 3 4 5 6 BGA PACKAGE BGA PACKAGE 48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE 48-LEAD (9mm × 6.25mm × 3.32mm) BGA PACKAGE TJMAX = 150°C, θJA = 24.7°C/W, θJCbottom = 4.5°C/W TJMAX = 150°C, θJA = 24.7°C/W, θJCbottom = 4.5°C/W θJCtop = 22.3°C/W, θJB = 4.2°C/W, WEIGHT = 0.5g θJCtop = 22.3°C/W, θJB = 4.2°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC51-9, 51-12 θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8003IY#PBF SAC305 (RoHS) LTM8003 e1 BGA 3 –40°C to 125°C LTM8003HY#PBF SAC305 (RoHS) LTM8003 e1 BGA 3 –40°C to 150°C LTM8003IY SnPb (63/37) LTM8003 e0 BGA 3 –40°C to 125°C LTM8003HY SnPb (63/37) LTM8003 e0 BGA 3 –40°C to 150°C LTM8003IY-3.3#PBF SAC305 (RoHS) LTM8003-3.3 e1 BGA 3 –40°C to 125°C LTM8003HY-3.3#PBF SAC305 (RoHS) LTM8003-3.3 e1 BGA 3 –40°C to 150°C • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev E 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Photo Package Description Revision History Typical Application Design Resources Related Parts