Datasheet LTM4632 (Analog Devices) - 26
| 制造商 | Analog Devices |
| 描述 | Ultrathin, Triple Output, Step-Down μModule Regulator for DDR-QDR4 Memory |
| 页数 / 页 | 28 / 26 — PACKAGE DESCRIPTION. 2.42mm). NOTES. 6.25mm. MAX. BGA Package. … |
| 修订版 | D |
| 文件格式/大小 | PDF / 2.5 Mb |
| 文件语言 | 英语 |
PACKAGE DESCRIPTION. 2.42mm). NOTES. 6.25mm. MAX. BGA Package. DIMENSIONS. NOM. 25-Lead (6.25mm. MIN. SYMBOL
该数据表的模型线
文件文字版本
LTM4632
PACKAGE DESCRIPTION
0517 REV A Y BGA 25 AR ACKAGE TED. Y V 6 ATION SEE NOTES PIN 1 A B C D E TIONAL, 1 AIL A DET 2 TOM VIEW Y BE EITHER A MOLD OR Y LOADING ORIENT TING PLANE Y 3 G TED WITHIN THE ZONE INDICA 4 TION PER JESD MS-028 AND JEP95 5 PACKAGE BOT TURE LTMXXXXXX µModule TUM -Z- IS SEA PACKAGE IN TRA YOUT CAREFULL e Y DA PACKAGE ROW AND COLUMN LABELING MA AMONG µModule PRODUCTS. REVIEW EACH P LA 3 F AILS OF PIN #1 IDENTIFIER ARE OP
!
SEE NOTES b LL DIMENSIONS ARE IN MILLIMETERS DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. A 3 BALL DESIGNA 4 5. PRIMAR 6 Y PIN 1 BEVEL PIN “A1” TRA COMPONENT Z ×
2.42mm)
A TE THK A2 AIL B DET PACKAGE SIDE VIEW
NOTES
BALL HT BALL DIMENSION PAD DIMENSION SUBSTRA MOLD CAP HT ×
6.25mm MAX
2.62 0.70 1.92 0.90 0.66 0.37 1.55 0.15 0.10 0.20 0.30 0.15 Z Y
BGA Package
TE X Z Z H1 M M A1 SUBSTRA
DIMENSIONS
ddd eee
NOM
2.42 0.60 1.82 0.75 0.63 6.25 6.25 1.27 5.08 5.08 0.32 1.50 b1 AL NUMBER OF BALLS: 25 (Reference LTC DWG # 05-08-1502 Rev A) AIL B H2 AIL A
25-Lead (6.25mm
TOT ccc Z DET
MIN
2.22 0.50 1.72 0.60 0.60 0.27 1.45 MOLD CAP // bbb Z DET Øb (25 PLACES) A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee
SYMBOL
aaa Z X D Y 0.630 ±0.025 2.540 YOUT 1.270 0.3175 0.000 E 0.3175 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LA aaa Z 2.540 1.270 1.270 2.540 4 0.3175 0.3175 PIN “A1” CORNER 0.000 Rev. D 26 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts
PACKAGE DESCRIPTION
0517 REV A Y BGA 25 AR ACKAGE TED. Y V 6 ATION SEE NOTES PIN 1 A B C D E TIONAL, 1 AIL A DET 2 TOM VIEW Y BE EITHER A MOLD OR Y LOADING ORIENT TING PLANE Y 3 G TED WITHIN THE ZONE INDICA 4 TION PER JESD MS-028 AND JEP95 5 PACKAGE BOT TURE LTMXXXXXX µModule TUM -Z- IS SEA PACKAGE IN TRA YOUT CAREFULL e Y DA PACKAGE ROW AND COLUMN LABELING MA AMONG µModule PRODUCTS. REVIEW EACH P LA 3 F AILS OF PIN #1 IDENTIFIER ARE OP
!
SEE NOTES b LL DIMENSIONS ARE IN MILLIMETERS DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. A 3 BALL DESIGNA 4 5. PRIMAR 6 Y PIN 1 BEVEL PIN “A1” TRA COMPONENT Z ×
2.42mm)
A TE THK A2 AIL B DET PACKAGE SIDE VIEW
NOTES
BALL HT BALL DIMENSION PAD DIMENSION SUBSTRA MOLD CAP HT ×
6.25mm MAX
2.62 0.70 1.92 0.90 0.66 0.37 1.55 0.15 0.10 0.20 0.30 0.15 Z Y
BGA Package
TE X Z Z H1 M M A1 SUBSTRA
DIMENSIONS
ddd eee
NOM
2.42 0.60 1.82 0.75 0.63 6.25 6.25 1.27 5.08 5.08 0.32 1.50 b1 AL NUMBER OF BALLS: 25 (Reference LTC DWG # 05-08-1502 Rev A) AIL B H2 AIL A
25-Lead (6.25mm
TOT ccc Z DET
MIN
2.22 0.50 1.72 0.60 0.60 0.27 1.45 MOLD CAP // bbb Z DET Øb (25 PLACES) A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee
SYMBOL
aaa Z X D Y 0.630 ±0.025 2.540 YOUT 1.270 0.3175 0.000 E 0.3175 1.270 TOP VIEW PACKAGE TOP VIEW 2.540 SUGGESTED PCB LA aaa Z 2.540 1.270 1.270 2.540 4 0.3175 0.3175 PIN “A1” CORNER 0.000 Rev. D 26 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts