Datasheet MxL7213 (MaxLinear)

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MxL7213
Product Brief Dual 13A or Single 26A Power Module General Description Features The MxL7213 dual step-down power module integrates the ■ Dual 13A or single 26A output control, drivers, bootstrap diodes, inductors and MOSFETs in a single package for point-of-load supplies. Operating from ■ Input Voltage Range: 4.5V to 18V an input voltage range of 4.5V to 18V, the MxL7213 supports ■ two outputs each with an output voltage range of 0.6V to Output Voltage Range: 0.6V to 5.3V 5.3V, set by a single external resistor. Just a few input and ■ Multiphase current sharing with multiple MxL7213s for up output capacitors are required. It supplies either two 13A to 100A output outputs, a single 26A or up to100A when paralleled with ■ additional MxL7213 modules. Attention to thermal design, Frequency synchronization component selection and internal construction results in ■ Higher efficiency and wider VIN range than competitive higher efficiency and extended operating range than devices devices with same compatible industry standard pinout with the same industry standard pinout. ■ Remote differential sense amplifier Supply rail sequencing is supported as well as frequency synchronization, multiphase operation and output voltage ■ Peak current mode architecture for fast transient tracking. Device temperature monitoring is accomplished with response an onboard temperature diode. The peak current mode ■ Adjustable switching frequency (250kHz to 780kHz) architecture provides very fast transient responses to line and load changes and doesn’t sacrifice stability. ■ Overcurrent protection A host of protection features, including over-current, over- ■ Output overvoltage protection temperature, short-circuit and UVLO, help achieve safe ■ Internal temperature monitor and thermal shutdown operation under abnormal operating conditions. Available in protection space saving and thermally enhanced 15mm x 15mm packaging, the 4.41mm height LGA package and the 5.01mm ■ Thermally enhanced (15mm x 15mm x 4.41mm) LGA height BGA package have RoHS compliant terminal finish. package and (15mm x 15mm x 5.01mm) BGA package Applications ■ Telecom and Networking Equipment ■ Industrial Equipment ■ Test Equipment Typical Application Ordering Information - page 4 INTV E CC ĸciency vs. IOUT CVCC 100 4.7μF RPGOOD 5k VOUT PGOOD1 95 VIN MODE_PLLIN CLKOUT INTVCC EXTVCC PGOOD1 7V to 18V VIN VOUT1 90 R1 CIN R TEMP VOUTS1 TEMP COUT1 10k RUN1 DIFFOUT Optional (%) RUN2 SW1 CFF 85 TRACK1 VFB1 ency D1 ci TRACK2 VFB2 5.1V Zener R Eĸ Optional INTVCC FSET FB 80 CSS MxL7213 COMP1 8.25k PHASMD COMP2 0.1μF MxL7213, 5VOUT VOUTS2 CompeƟtor A, 5V VOUT2 VOUT 75 OUT SW2 5V 26A MxL7213, 1VOUT PGOOD2 PGOOD2 COUT2 CompeƟtor A, 1VOUT SGND GND DIFFP DIFFN 70 0 1 2 3 4 5 6 7 8 9 10 11 12 13 I (A) OUT
Figure 1: Typical Application: 26A, 5V Output DC/DC Power Module Figure 2: Efficiency Advantage vs. Competition
• www.maxlinear.com• 200PBR00 Document Outline General Description Applications Functional Block Diagram Typical Application Pin Configuration Ordering Information