Datasheet MMBT3906L, SMMBT3906L (ON Semiconductor)
| 制造商 | ON Semiconductor |
| 描述 | PNP Bipolar Transistor |
| 页数 / 页 | 7 / 1 — PNP Silicon. Features. www.onsemi.com. MAXIMUM RATINGS. Rating. Symbol. … |
| 修订版 | 13 |
| 文件格式/大小 | PDF / 89 Kb |
| 文件语言 | 英语 |
PNP Silicon. Features. www.onsemi.com. MAXIMUM RATINGS. Rating. Symbol. Value. Unit. SOT−23 (TO−236). THERMAL CHARACTERISTICS. CASE 318
该数据表的模型线
文件文字版本
link to page 1 link to page 1 link to page 1 MMBT3906L, SMMBT3906L General Purpose Transistor
PNP Silicon Features
• S Prefix for Automotive and Other Applications Requiring Unique
www.onsemi.com
Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable COLLECTOR • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 3 Compliant 1 BASE
MAXIMUM RATINGS
2
Rating Symbol Value Unit
EMITTER Collector − Emitter Voltage VCEO −40 Vdc Collector − Base Voltage VCBO −40 Vdc 3 Emitter − Base Voltage VEBO −5.0 Vdc 1 Collector Current − Continuous IC −200 mAdc 2 Collector Current − Peak (Note 3) ICM −800 mAdc
SOT−23 (TO−236) THERMAL CHARACTERISTICS CASE 318 Characteristic Symbol Max Unit STYLE 6
Total Device Dissipation FR− 5 Board PD (Note 1) @ TA = 25°C 225 mW
MARKING DIAGRAM
Derate above 25°C 1.8 mW/°C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Total Device Dissipation Alumina PD 2A M G Substrate, (Note 2) @ TA = 25°C 300 mW G Derate above 25°C 2.4 mW/°C 1 Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W 2A = Specific Device Code Junction and Storage Temperature TJ, Tstg −65 to +150 °C M = Date Code* Stresses exceeding those listed in the Maximum Ratings table may damage the G = Pb−Free Package device. If any of these limits are exceeded, device functionality should not be (Note: Microdot may be in either location) assumed, damage may occur and reliability may be affected. *Date Code orientation and/or overbar may 1. FR− 5 = 1.0 0.75 0.062 in. vary depending upon manufacturing location. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 3. Reference SOA curve.
ORDERING INFORMATION Device Package Shipping
† MMBT3906LT1G SOT−23 3,000 / Tape & (Pb−Free) Reel MMBT3906LT3G SOT−23 10,000 / Tape & (Pb−Free) Reel SMMBT3906LT1G SOT−23 3,000 / Tape & (Pb−Free) Reel SMMBT3906LT3G SOT−23 10,000 / Tape & (Pb−Free) Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 1994
1
Publication Order Number:
August, 2017 − Rev. 13 MMBT3906LT1/D
PNP Silicon Features
• S Prefix for Automotive and Other Applications Requiring Unique
www.onsemi.com
Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable COLLECTOR • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 3 Compliant 1 BASE
MAXIMUM RATINGS
2
Rating Symbol Value Unit
EMITTER Collector − Emitter Voltage VCEO −40 Vdc Collector − Base Voltage VCBO −40 Vdc 3 Emitter − Base Voltage VEBO −5.0 Vdc 1 Collector Current − Continuous IC −200 mAdc 2 Collector Current − Peak (Note 3) ICM −800 mAdc
SOT−23 (TO−236) THERMAL CHARACTERISTICS CASE 318 Characteristic Symbol Max Unit STYLE 6
Total Device Dissipation FR− 5 Board PD (Note 1) @ TA = 25°C 225 mW
MARKING DIAGRAM
Derate above 25°C 1.8 mW/°C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Total Device Dissipation Alumina PD 2A M G Substrate, (Note 2) @ TA = 25°C 300 mW G Derate above 25°C 2.4 mW/°C 1 Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W 2A = Specific Device Code Junction and Storage Temperature TJ, Tstg −65 to +150 °C M = Date Code* Stresses exceeding those listed in the Maximum Ratings table may damage the G = Pb−Free Package device. If any of these limits are exceeded, device functionality should not be (Note: Microdot may be in either location) assumed, damage may occur and reliability may be affected. *Date Code orientation and/or overbar may 1. FR− 5 = 1.0 0.75 0.062 in. vary depending upon manufacturing location. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 3. Reference SOA curve.
ORDERING INFORMATION Device Package Shipping
† MMBT3906LT1G SOT−23 3,000 / Tape & (Pb−Free) Reel MMBT3906LT3G SOT−23 10,000 / Tape & (Pb−Free) Reel SMMBT3906LT1G SOT−23 3,000 / Tape & (Pb−Free) Reel SMMBT3906LT3G SOT−23 10,000 / Tape & (Pb−Free) Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 1994
1
Publication Order Number:
August, 2017 − Rev. 13 MMBT3906LT1/D