Datasheet MAX6627 (Maxim) - 5
| 制造商 | Maxim |
| 描述 | Remote ±1°C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface |
| 页数 / 页 | 10 / 5 — Pin Configurations. SOT23. TDFN. Pin Description. PIN. NAME. FUNCTION |
| 修订版 | 7 |
| 文件格式/大小 | PDF / 1.1 Mb |
| 文件语言 | 英语 |
Pin Configurations. SOT23. TDFN. Pin Description. PIN. NAME. FUNCTION
该数据表的模型线
文件文字版本
MAX6627/MAX6628 Remote ±1°C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface
Pin Configurations
N.C. SDO CS SCK TOP VIEW 8 7 6 5 GND 1 8 N.C. DXN 2 7 SDO MAX6627 MAX6627 DXP 3 6 CS MAX6628 VCC 4 5 SCK
+
EP
SOT23
1 2 3 4 GND DXN DXP VCC
TDFN Pin Description PIN NAME FUNCTION
1 GND Ground 2 DXN Combined Current Sink and ADC Negative Input for Remote Diode. DXN is normally biased to a diode voltage above ground. 3 DXP Combined Current Source and ADC Positive Input for Remote Diode. Place a 2200pF capacitor between DXP and DXN for noise filtering. 4 VCC Supply Voltage Input. Bypass with a 0.1µF to GND. 5 SCK SPI Clock Input 6 CS Chip-Select Input. Pulling CS low initiates an idle state, but the SPI interface is still enabled. A rising-edge of CS initiates the next conversion. 7 SDO SPI Data Output 8 N.C. No Connect. Internally not connected. Can be connected to GND for improved thermal conductivity. — EP Exposed Pad. Internally connected to GND. Connect to a large ground plane to maximize thermal performance. Not intended as an electrical connection point. www.maximintegrated.com Maxim Integrated │ 5
Pin Configurations
N.C. SDO CS SCK TOP VIEW 8 7 6 5 GND 1 8 N.C. DXN 2 7 SDO MAX6627 MAX6627 DXP 3 6 CS MAX6628 VCC 4 5 SCK
+
EP
SOT23
1 2 3 4 GND DXN DXP VCC
TDFN Pin Description PIN NAME FUNCTION
1 GND Ground 2 DXN Combined Current Sink and ADC Negative Input for Remote Diode. DXN is normally biased to a diode voltage above ground. 3 DXP Combined Current Source and ADC Positive Input for Remote Diode. Place a 2200pF capacitor between DXP and DXN for noise filtering. 4 VCC Supply Voltage Input. Bypass with a 0.1µF to GND. 5 SCK SPI Clock Input 6 CS Chip-Select Input. Pulling CS low initiates an idle state, but the SPI interface is still enabled. A rising-edge of CS initiates the next conversion. 7 SDO SPI Data Output 8 N.C. No Connect. Internally not connected. Can be connected to GND for improved thermal conductivity. — EP Exposed Pad. Internally connected to GND. Connect to a large ground plane to maximize thermal performance. Not intended as an electrical connection point. www.maximintegrated.com Maxim Integrated │ 5