Datasheet HMC3587LP3BE (Analog Devices) - 3

制造商Analog Devices
描述HBT GAIN BLOCK MMIC AMPLIFIER, 4 - 10 GHz
页数 / 页8 / 3 — HMC3587LP3BE. HBT GAIN BLOCK. MMIC AMPLIFIER, 4 - 10 GHz. Psat vs. …
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HMC3587LP3BE. HBT GAIN BLOCK. MMIC AMPLIFIER, 4 - 10 GHz. Psat vs. Temperature. Output IP3 vs. Temperature

HMC3587LP3BE HBT GAIN BLOCK MMIC AMPLIFIER, 4 - 10 GHz Psat vs Temperature Output IP3 vs Temperature

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HMC3587LP3BE
v02.0717
HBT GAIN BLOCK MMIC AMPLIFIER, 4 - 10 GHz Psat vs. Temperature Output IP3 vs. Temperature
20 35 T 18 +25C m 30 +85C -40C s 16 ) 14 25 (dBm) (dBm r - 12 +25C Psat IP3 20 e +85C -40C 10 w 15 8 o p 6 10 4 5 6 7 8 9 10 4 5 6 7 8 9 10 FREQUENCY (GHz) FREQUENCY (GHz) r & A e
Phase Noise @ Pin=0 dBm Power Compression @ 5 GHz
-100 20 lin -110 (%) 15 -120 s - z) PAE c/H -130 5 GHz Pout r dB 7 GHz 10 Gain ( (dB), E PAE -140 IS ie O GAIN N E -150 5 S A H lif P -160 (dBm), 0 p -170 Pout m -180 -5 A 10 102 103 104 105 106 107 108 -20 -15 -10 -5 0 5 OFFSET(Hz) INPUT POWER (dBm)
Power Compression @ 7 GHz Power Compression @ 9 GHz
20 20 (%) (%) 15 15 PAE PAE Pout Pout 10 Gain (dB), 10 Gain (dB), PAE PAE GAIN GAIN 5 5 (dBm), (dBm), 0 0 Pout Pout -5 -5 -20 -17 -14 -11 -8 -5 -2 1 4 7 -20 -17 -14 -11 -8 -5 -2 1 4 7 INPUT POWER (dBm) INPUT POWER (dBm) For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Second Harmonics vs. Pout Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Temperature @ Pout = 18 dBm Power Dissipation Power Compression @ 10 GHz Psat vs. Vdd P1dB vs. Vdd Psat vs. Temperature P1dB vs. Temperature Noise Figure vs. Frequency Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Gain & Return Loss Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit