ADL5534Data Sheet60–25) dB (50–30TIONOLA40%)–35(T ISEUAGTP30NT–40OU TERCEAENP20R–45LTE10–50T TO A U P0IN36.637.438.239.039.840.641.4–55 009 2060100 140 180 220 260 300 340 380 420 460 50037.037.838.639.440.241.041.8 011 OIP3 (dBm) 06836- FREQUENCY (MHz) 06836- Figure 9. OIP3 Distribution at 190 MHz Figure 12. Device-to-Device Isolation vs. Frequency 1004.0903.8803.670)3.4%)dB(60(E3.2E RAG503.0NTFIGU40ERCE2.8E POIS30N2.6202.4102.202.019.019.419.820.220.621.021.421.8 010 050100150200250300350400450500 013 P1dB (dBm)FREQUENCY (MHz) 06836- 06836- Figure 10. P1dB Distribution at 190 MHz Figure 13. Noise Figure vs. Frequency at 25°C, Multiple Devices Shown 701501406013050120%)mA)((5.25VE40110NTAG NT10030CURRERCEY90ELPP5V20UP80S7010604.75V05019.719.920.120.320.520.720.9 012 –40 –30 –20 –10010203040506070809019.820.020.220.420.620.821.0 014 GAIN (dB) 06836- TEMPERATURE (°C) 06836- Figure 11. Gain Distribution at 190 MHz Figure 14. Supply Current vs. Temperature and Supply Voltage Rev. B | Page 8 of 16 Document Outline Features Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Basic Connections Using Baluns to Combine Both Amplifiers into a Single Amplifier ADC Driving Application Soldering Information and Recommended PCB Land Pattern Evaluation Board Outline Dimensions Ordering Guide