Datasheet HMC311ST89, 311ST89E (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz |
| 页数 / 页 | 6 / 4 — HMC311ST89 / 311ST89E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 6 GHz. … |
| 文件格式/大小 | PDF / 893 Kb |
| 文件语言 | 英语 |
HMC311ST89 / 311ST89E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 6 GHz. Absolute Maximum Ratings. Outline Drawing
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文件文字版本
HMC311ST89 / 311ST89E
v04.0517
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +7V RF Input Power (RFIN)(Vcc = +3.9V) +10 dBm ELECTROSTATIC SENSITIVE DEVICE T Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS M Continuous Pdiss (T = 85 °C) 0.34 W (derate 5.21 mW/°C above 85 °C) Thermal Resistance 191 °C/W (junction to lead) K - S Storage Temperature -65 to +150 °C C Operating Temperature -40 to +85 °C Class1A, LO ESD Sensitivity (HBM) Passed 250V IN B A
Outline Drawing
R & G E IV R R - D IE ILF P NOTES: M 1. PACKAGE BODY MATERIAL: A MOLDING COMPOUND MP-180S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC311ST89 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 311 XXXX HMC311ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H311 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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v04.0517
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +7V RF Input Power (RFIN)(Vcc = +3.9V) +10 dBm ELECTROSTATIC SENSITIVE DEVICE T Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS M Continuous Pdiss (T = 85 °C) 0.34 W (derate 5.21 mW/°C above 85 °C) Thermal Resistance 191 °C/W (junction to lead) K - S Storage Temperature -65 to +150 °C C Operating Temperature -40 to +85 °C Class1A, LO ESD Sensitivity (HBM) Passed 250V IN B A
Outline Drawing
R & G E IV R R - D IE ILF P NOTES: M 1. PACKAGE BODY MATERIAL: A MOLDING COMPOUND MP-180S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC311ST89 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 311 XXXX HMC311ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H311 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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