Datasheet HMC311LP3 / 311LP3E (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | InGaP HBT Gain Block Amplifier SMT, DC - 6 GHz |
| 页数 / 页 | 6 / 4 — HMC311LP3 / 311LP3E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 6 GHz. … |
| 文件格式/大小 | PDF / 955 Kb |
| 文件语言 | 英语 |
HMC311LP3 / 311LP3E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 6 GHz. Absolute Maximum Ratings. Outline Drawing
文件文字版本
HMC311LP3 / 311LP3E
v06.0617
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +7V RF Input Power (RFIN)(Vs = +5V) +10 dBm ELECTROSTATIC SENSITIVE DEVICE T Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS M Continuous Pdiss (T = 85 °C) 0.339 W (derate 5.21 mW/°C above 85 °C) Thermal Resistance 192 °C/W (junction to ground paddle) S - S Storage Temperature -65 to +150 °C R Operating Temperature -40 to +85 °C IE Class 1A, ESD Sensitivity (HBM) Passed 250V LIF P
Outline Drawing
M K A C LO IN B A R & G E NOTES: IV 1. LEADFRAME MATERIAL: COPPER ALLOY R 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] D 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC311LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 311 XXXX HMC311LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 311 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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v06.0617
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +7V RF Input Power (RFIN)(Vs = +5V) +10 dBm ELECTROSTATIC SENSITIVE DEVICE T Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS M Continuous Pdiss (T = 85 °C) 0.339 W (derate 5.21 mW/°C above 85 °C) Thermal Resistance 192 °C/W (junction to ground paddle) S - S Storage Temperature -65 to +150 °C R Operating Temperature -40 to +85 °C IE Class 1A, ESD Sensitivity (HBM) Passed 250V LIF P
Outline Drawing
M K A C LO IN B A R & G E NOTES: IV 1. LEADFRAME MATERIAL: COPPER ALLOY R 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] D 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC311LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 311 XXXX HMC311LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 311 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4