Datasheet MAX22513 (Maxim) - 3
| 制造商 | Maxim |
| 描述 | Surge Protected Dual Driver IO-Link Device Transceiver with DC-DC |
| 页数 / 页 | 46 / 3 — Absolute Maximum Ratings. Note 1:. Package Information. PACKAGE TYPE: 28 … |
| 文件格式/大小 | PDF / 1.3 Mb |
| 文件语言 | 英语 |
Absolute Maximum Ratings. Note 1:. Package Information. PACKAGE TYPE: 28 TQFN. 21-0184. 90-0123
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MAX22513 Surge Protected Dual Driver IO-Link Device Transceiver with DC-DC
Absolute Maximum Ratings
(All voltages referenced to GND unless otherwise noted.) IRQ ..-0.3V to +6V V24 (Continuous) ..-36V to +36V DGND, SGND ..-0.3V to +0.3V V24 (Peak, 100μs) ..-52V to +65V Continuous Current into V24, LX, GND, or DGND ..±1A PV24 (Continuous) (Note 1) ... max(-0.3V, V24 - 3V) to +36V Continuous Current into PV24 ...±300mA PV24 (Peak, 100μs) ..max(-0.3V, V24 - 52V) Peak Current into PV24 (100μs) ...±1A to min(+52V, V24 + 52V) Continuous Current into C/Q and DO/DI ..±500mA LX ... -0.3V to (PV24 + 0.3V) Continuous Current into Any Other Pin ..±50mA LIN (Continuous) ...max(-0.3V, V5 - 0.3V) to +36V Continuous Power Dissipation (28-pin TQFN) LIN (Peak, 100μs) ...max(-0.3V, V5 - 0.3V) to +52V (TA = +70°C (derate at 28.6mW/°C C/Q, DO/DI (Continuous) ...max(-36V, V24 - 36V) above +70°C)) ...2280mW to min(+36V, V24 + 36V) Continuous Power Dissipation (30-bump WLP) C/Q, DO/DI (Peak, 100μs) ...max(-52V, V24 - 52V) (TA = +70°C (derate at 20.76mW/°C to min(+52V, V24 + 52V) above +70°C)) ...3850mW V5, FB, VCCB, RESET, FREQ ..-0.3V to +6V Operating Temperature Range ... -40°C to +125°C VL ..-0.3V to +6V Maximum Junction Temperature ...+165°C V33 ...-0.3V to (V5 + 0.3V) Storage Temperature Range .. -40°C to +150°C LOGIC INPUTS ... Soldering Temperature (reflow) SPI/I2C, CS/A0, SCLK, SDI/A1, (TQFN only, soldering, 10 sec) ..+300°C SDO/SDA, TX, TXEN, LO/LI ... -0.3V to (VL + 0.3V) Bump Reflow Temperature ..+260°C LOGIC OUTPUTS WU, SDO/SDA, RX, LO/LI, MCLK ..-0.3V to (VL + 0.3V) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 1:
During power-up, (V24 - PV24) voltage can be up to +52V until the internal active diode turns on.
Package Information PACKAGE TYPE: 28 TQFN
Package Code T283555+1C Outline Number
21-0184
Land Pattern Number
90-0123 THERMAL RESISTANCE, FOUR-LAYER BOARD:
Junction to Ambient (θJA) 35°C/W Junction to Case (θJC) 2.7°C/W
PACKAGE TYPE: 8 x 4 WLP
Package Code W322A4+1 Outline Number
21-100247
Land Pattern Number Refer to
Application Note 1891 THERMAL RESISTANCE, FOUR-LAYER BOARD:
Junction to Ambient (θJA) 48.16°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 3
Absolute Maximum Ratings
(All voltages referenced to GND unless otherwise noted.) IRQ ..-0.3V to +6V V24 (Continuous) ..-36V to +36V DGND, SGND ..-0.3V to +0.3V V24 (Peak, 100μs) ..-52V to +65V Continuous Current into V24, LX, GND, or DGND ..±1A PV24 (Continuous) (Note 1) ... max(-0.3V, V24 - 3V) to +36V Continuous Current into PV24 ...±300mA PV24 (Peak, 100μs) ..max(-0.3V, V24 - 52V) Peak Current into PV24 (100μs) ...±1A to min(+52V, V24 + 52V) Continuous Current into C/Q and DO/DI ..±500mA LX ... -0.3V to (PV24 + 0.3V) Continuous Current into Any Other Pin ..±50mA LIN (Continuous) ...max(-0.3V, V5 - 0.3V) to +36V Continuous Power Dissipation (28-pin TQFN) LIN (Peak, 100μs) ...max(-0.3V, V5 - 0.3V) to +52V (TA = +70°C (derate at 28.6mW/°C C/Q, DO/DI (Continuous) ...max(-36V, V24 - 36V) above +70°C)) ...2280mW to min(+36V, V24 + 36V) Continuous Power Dissipation (30-bump WLP) C/Q, DO/DI (Peak, 100μs) ...max(-52V, V24 - 52V) (TA = +70°C (derate at 20.76mW/°C to min(+52V, V24 + 52V) above +70°C)) ...3850mW V5, FB, VCCB, RESET, FREQ ..-0.3V to +6V Operating Temperature Range ... -40°C to +125°C VL ..-0.3V to +6V Maximum Junction Temperature ...+165°C V33 ...-0.3V to (V5 + 0.3V) Storage Temperature Range .. -40°C to +150°C LOGIC INPUTS ... Soldering Temperature (reflow) SPI/I2C, CS/A0, SCLK, SDI/A1, (TQFN only, soldering, 10 sec) ..+300°C SDO/SDA, TX, TXEN, LO/LI ... -0.3V to (VL + 0.3V) Bump Reflow Temperature ..+260°C LOGIC OUTPUTS WU, SDO/SDA, RX, LO/LI, MCLK ..-0.3V to (VL + 0.3V) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 1:
During power-up, (V24 - PV24) voltage can be up to +52V until the internal active diode turns on.
Package Information PACKAGE TYPE: 28 TQFN
Package Code T283555+1C Outline Number
21-0184
Land Pattern Number
90-0123 THERMAL RESISTANCE, FOUR-LAYER BOARD:
Junction to Ambient (θJA) 35°C/W Junction to Case (θJC) 2.7°C/W
PACKAGE TYPE: 8 x 4 WLP
Package Code W322A4+1 Outline Number
21-100247
Land Pattern Number Refer to
Application Note 1891 THERMAL RESISTANCE, FOUR-LAYER BOARD:
Junction to Ambient (θJA) 48.16°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.maximintegrated.com Maxim Integrated │ 3