Datasheet DPS368 (Infineon) - 4
| 制造商 | Infineon |
| 描述 | XENSIV™ DPS368 - ultra small waterproof pressure sensor, environmentally protected against water (IPx8), dust & humidity |
| 页数 / 页 | 44 / 4 — DPS368. Table of contents. Register Map. Register description. Package … |
| 修订版 | 01_00 |
| 文件格式/大小 | PDF / 3.0 Mb |
| 文件语言 | 英语 |
DPS368. Table of contents. Register Map. Register description. Package Dimensions. Footprint and stencil recommendation
该数据表的模型线
文件文字版本
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DPS368 Table of contents
6.1 I2C Interface . 21 6.2 SPI Interface . 21 6.3 Interface parameters specification . 22 6.3.1 General interface parameters . .23 6.3.1.1 I2C timings . 23 6.3.1.2 SPI timings . 25
7 Register Map
. .26
8 Register description
. 26 8.1 Pressure Data (PRS_Bn) . 26 8.1.1 PRS_B2 . 27 8.1.2 PRS_B1 . 27 8.1.3 PRS_B0 . 28 8.2 Temperature Data (TMP_Tn) . .28 8.2.1 TMP_B2 . 28 8.2.2 TMP_B1 . 29 8.2.3 TMP_B0 . 29 8.3 Pressure Configuration (PRS_CFG) . 30 8.4 Temperature Configuration(TMP_CFG) . 32 8.5 Sensor Operating Mode and Status (MEAS_CFG) . 33 8.6 Interrupt and FIFO configuration (CFG_REG) . 34 8.7 Interrupt Status (INT_STS) . .35 8.8 FIFO Status (FIFO_STS) . .36 8.9 Soft Reset and FIFO flush (RESET) . 37 8.10 Product and Revision ID (ID) . 37 8.11 Calibration Coefficients (COEF) . 38 8.12 Coefficient Source . 39
9 Package Dimensions
. .39 9.1 Package drawing . 39
10 Footprint and stencil recommendation
. 40
11 Reflow soldering and board assembly
. 41
12 Package Handling
. 43
Revision history
. 43
Disclaimer
. 44 Preliminary datasheet 4 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer
DPS368 Table of contents
6.1 I2C Interface . 21 6.2 SPI Interface . 21 6.3 Interface parameters specification . 22 6.3.1 General interface parameters . .23 6.3.1.1 I2C timings . 23 6.3.1.2 SPI timings . 25
7 Register Map
. .26
8 Register description
. 26 8.1 Pressure Data (PRS_Bn) . 26 8.1.1 PRS_B2 . 27 8.1.2 PRS_B1 . 27 8.1.3 PRS_B0 . 28 8.2 Temperature Data (TMP_Tn) . .28 8.2.1 TMP_B2 . 28 8.2.2 TMP_B1 . 29 8.2.3 TMP_B0 . 29 8.3 Pressure Configuration (PRS_CFG) . 30 8.4 Temperature Configuration(TMP_CFG) . 32 8.5 Sensor Operating Mode and Status (MEAS_CFG) . 33 8.6 Interrupt and FIFO configuration (CFG_REG) . 34 8.7 Interrupt Status (INT_STS) . .35 8.8 FIFO Status (FIFO_STS) . .36 8.9 Soft Reset and FIFO flush (RESET) . 37 8.10 Product and Revision ID (ID) . 37 8.11 Calibration Coefficients (COEF) . 38 8.12 Coefficient Source . 39
9 Package Dimensions
. .39 9.1 Package drawing . 39
10 Footprint and stencil recommendation
. 40
11 Reflow soldering and board assembly
. 41
12 Package Handling
. 43
Revision history
. 43
Disclaimer
. 44 Preliminary datasheet 4 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer