Datasheet ADuM4121/ADuM4121-1 (Analog Devices) - 4

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ADuM4121/ADuM4121-1 Data Sheet Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Skew3 tPSK 22 ns CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω Falling Edge4 tPSKHL 12 ns CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω Rising Edge5 tPSKLH 15 ns CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω Pulse Width Distortion tPWD 7 13 ns CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω Output Rise/Fall Time (10% to 90%) tR/tF 11 18 26 ns CL = 2 nF, VDD2 = 15 V, RGON = RGOFF = 5 Ω Common-Mode Transient Immunity (CMTI) |CM| Static CMTI6 150 kV/µs VCM = 1500 V Dynamic CMTI7 150 kV/µs VCM = 1500 V 1 RGON and RGOFF are the external gate resistors in the test. 2 tDLH propagation delay is measured from the time of the input rising logic high threshold, VIH, to the output rising 10% threshold of the VOUT signal. tDHL propagation delay is measured from the input fal ing logic low threshold, VIL, to the output fal ing 90% threshold of the VOx signal. See Figure 24 for waveforms of the propagation delay parameters. 3 tPSK is the magnitude of the worst case difference in tDLH and/or tDHL that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. See Figure 24 for waveforms of the propagation delay parameters. 4 tPSKHL is the magnitude of the worst case difference in tDHL that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. See Figure 24 for waveforms of the propagation delay parameters. 5 tPSKLH is the magnitude of the worst case difference in tDLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. See Figure 24 for waveforms of the propagation delay parameters. 6 Static common-mode transient immunity (CMTI) is defined as the largest dv/dt between GND1 and GND2, with inputs held either high or low, such that the output voltage remains either above 0.8 × VDD2 for output high or 0.8 V for output low. Operation with transients above recommended levels can cause momentary data upsets. 7 Dynamic common-mode transient immunity (CMTI) is defined as the largest dv/dt between GND1 and GND2 with the switching edge coincident with the transient test pulse. Operation with transients above the recommended levels can cause momentary data upsets.
REGULATORY INFORMATION
The ADuM4121/ADuM4121-1 are pending approval by the organizations listed in Table 2.
Table 2. UL (Pending) CSA (Pending) VDE (Pending) CQC (Pending)
UL1577 Component Approved under CSA Component Acceptance DIN V VDE V 0884-10 Certified under CQC11- Recognition Program Notice 5A (VDE V 0884-10):2006-12 471543-2012 Single Protection, 5000 V rms CSA 60950-1-07+A1+A2 and IEC 60950-1, second Reinforced insulation, 849 V GB4943.1-2011 Isolation Voltage edition, +A1+A2: peak, VIOSM = 10 kV peak Basic insulation at 800 V rms (1131 V peak) Basic insulation 849 V peak, Basic insulation at 800 V rms VIOSM = 16 kV peak (1131 V peak) Reinforced insulation at 400 V rms (565 V peak) Reinforced insulation at 400 V rms (565 V peak) IEC 60601-1 Edition 3.1: Basic insulation (1 MOPP), 500 V rms (707 V peak) Reinforced insulation (2 MOPP), 250 V rms (1414 V peak) CSA 61010-1-12 and IEC 61010-1 third edition Basic insulation at: 600 V rms mains, 800 V secondary (1089 V peak) Reinforced insulation at: 300 V rms mains, 400 V secondary (565 V peak) File E214100 File 205078 File 2471900-4880-0001 File (pending)
PACKAGE CHARACTERISTICS Table 3. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Resistance (Input Side to High-Side Output)1 RI-O 1012 Ω Capacitance (Input Side to High-Side Output)1 CI-O 2.0 pF Input Capacitance CI 4.0 pF Junction to Top Characterization Parameter ΨJT 7.3 °C/W 4-layer PCB 1 The device is considered a two-terminal device: Pin 1 through Pin 4 are shorted together, and Pin 5 through Pin 8 are shorted together. Rev. 0| Page 4 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS REGULATORY INFORMATION PACKAGE CHARACTERISTICS INSULATION AND SAFETY-RELATED SPECIFICATIONS DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION PRINTED CIRCUIT BOARD (PCB) LAYOUT VI+ and VI− Operation PROPAGATION DELAY-RELATED PARAMETERS UNDERVOLTAGE LOCKOUT (UVLO) OUTPUT LOAD CHARACTERISTICS Miller Clamp POWER DISSIPATION INSULATION LIFETIME TYPICAL APPLICATIONS OUTLINE DIMENSIONS ORDERING GUIDE