High-Accuracy, Hall-Effect-Based Current Sensor ICACS724KMAwith Common-Mode Field Rejection in High-Isolation SOIC16 PackageSPECIFICATIONSABSOLUTE MAXIMUM RATINGSCharacteristicSymbolNotesRatingUnits Supply Voltage VCC 6 V Reverse Supply Voltage VRCC –0.1 V Output Voltage VIOUT VCC + 0.5 V Reverse Output Voltage VRIOUT –0.1 V Operating Ambient Temperature TA Range K –40 to 125 °C Junction Temperature TJ(max) 165 °C Storage Temperature Tstg –65 to 165 °C ISOLATION CHARACTERISTICSCharacteristicSymbolNotesRatingUnit Dielectric Surge Strength Test Voltage V Tested ±5 pulses at 2/minute in compliance to IEC 61000-4-5 SURGE 1.2 µs (rise) / 50 µs (width). 10000 V Agency type-tested for 60 seconds per UL 60950-1 Dielectric Strength Test Voltage VISO (edition 2). Production tested at 3000 VRMS for 1 second, in 4800 VRMS accordance with UL 60950-1 (edition 2). 1550 VPK Working Voltage for Basic Isolation V Maximum approved working voltage for basic (single) isolation WVBI according to UL 60950-1 (edition 2). 1097 VRMS or VDC 800 VPK Working Voltage for Reinforced Isolation V Maximum approved working voltage for reinforced isolation WVRI according to UL 60950-1 (edition 2). 565 VRMS or VDC Clearance Dcl Minimum distance through air from IP leads to signal leads. 7.5 mm Creepage D Minimum distance along package body from IP leads to signal cr leads 8.2 mm THERMAL CHARACTERISTICSCharacteristicSymbolTest Conditions*Value Units Mounted on the Allegro 85-0738 evaluation board with 700 mm2 of 4 oz. Package Thermal Resistance copper on each side, connected to pins 1 and 2, and to pins 3 and 4, with (Junction to Ambient) RθJA thermal vias connecting the layers. Performance values include the power 23 °C/W consumed by the PCB. Package Thermal Resistance (Junction to Lead) RθJL Mounted on the Allegro ASEK724 evaluation board. 5 °C/W *Additional thermal information available on the Allegro website. 3 Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com