Datasheet AD7291-EP (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | 8-Channel, I2C, 12-Bit SAR ADC with Temperature Sensor |
| 页数 / 页 | 8 / 5 — Enhanced Product. AD7291-EP. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| 文件格式/大小 | PDF / 188 Kb |
| 文件语言 | 英语 |
Enhanced Product. AD7291-EP. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
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Enhanced Product AD7291-EP ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board VDD to GND1, GND −0.3 V to +5 V (PCB) design and operating environment. Close attention to VDRIVE to GND1, GND −0.3 V to +5 V PCB thermal design is required. Analog Input Voltage to GND1 −0.3 V to +3 V Digital Input Voltage to GND1 −0.3 V to V
Table 3. Thermal Resistance
DRIVE + 0.3 V Digital Output Voltage to GND1 −0.3 V to V
Package Type θJA θJC Unit
DRIVE + 0.3 V V CP-20-81 52 6.5 °C/W REF to GND1 −0.3 V to +3 V GND to GND1 −0.3 V to +0.3 V 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test Input Current to Any Pin Except Supplies1 ±10 mA board with 9 thermal vias. See JEDEC JESD51. Operating Temperature Range −55°C to +125°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Junction Temperature 150°C Pb-free Temperature, Soldering Reflow 260(+0)°C ESD 2 kV 1 Transient currents of up to 100 mA do not cause latch-up. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board VDD to GND1, GND −0.3 V to +5 V (PCB) design and operating environment. Close attention to VDRIVE to GND1, GND −0.3 V to +5 V PCB thermal design is required. Analog Input Voltage to GND1 −0.3 V to +3 V Digital Input Voltage to GND1 −0.3 V to V
Table 3. Thermal Resistance
DRIVE + 0.3 V Digital Output Voltage to GND1 −0.3 V to V
Package Type θJA θJC Unit
DRIVE + 0.3 V V CP-20-81 52 6.5 °C/W REF to GND1 −0.3 V to +3 V GND to GND1 −0.3 V to +0.3 V 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test Input Current to Any Pin Except Supplies1 ±10 mA board with 9 thermal vias. See JEDEC JESD51. Operating Temperature Range −55°C to +125°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Junction Temperature 150°C Pb-free Temperature, Soldering Reflow 260(+0)°C ESD 2 kV 1 Transient currents of up to 100 mA do not cause latch-up. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE